Effects of solder balls and arrays on the failure behavior in Package-on-Package structure

Wang, Xi-Shu; She, Jia; Ren, Huaihui; Pan, Pan

doi:10.1016/j.microrel.2013.11.012

Cited by 4 publications

(7 citation statements)

References 24 publications

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“…Wang Yang [117] carried out environment tests using off-line coupled temperature cycling and temperature shock on Amkor's 14 mm × 14 mm and 15 mm × 15 mm PoP devices, obtaining strain values for the top chip and the bottom solder joints. Their results show a periodic variation in strain and stresses were mainly concentrated on the solder joints and chip.…”

Section: The Reliability Of Pop Memory Under Thermal Stressmentioning

confidence: 99%

“…From [116][117][118][119][120], it can be concluded that, in most research on the reliability of PoP packaging under thermal stress, a combination of finite element simulation, test verification, and solder joint fatigue life prediction formula was used to evaluate product reliability. Thermal stress loading is mainly based on thermal shock and temperature cycle test conditions, with the temperature loading condition of thermal shock in the range of −10-100 • C and the temperature loading conditions of the temperature cycle in the ranges of 0-125 • C, −10-100 • C, −55-125 • C, and −40-125 • C. The fatigue life of solder joints is greatly affected by different thermal stress loading conditions, such as temperature amplitude, residence time, and transition time.…”

Section: The Reliability Of Pop Memory Under Thermal Stressmentioning

confidence: 99%

“…Thermal stress loading is mainly based on thermal shock and temperature cycle test conditions, with the temperature loading condition of thermal shock in the range of −10-100 • C and the temperature loading conditions of the temperature cycle in the ranges of 0-125 • C, −10-100 • C, −55-125 • C, and −40-125 • C. The fatigue life of solder joints is greatly affected by different thermal stress loading conditions, such as temperature amplitude, residence time, and transition time. For example, [116][117][118][119][120] use a dual-layer PoP packaging device as the research object. According to the results of these studies, the weak-reliability areas of the product are mainly located in the bottom component and its outermost solder ball, which are also key areas of stress concentration.…”

Section: The Reliability Of Pop Memory Under Thermal Stressmentioning

confidence: 99%

“…The Coffin-Manson model is the most common plastic deformation fatigue prediction model (e.g., [116]), and there are other less common models, such as the Ostergren, Miller, and Engelmaier models. The Knecht-Fox model is the most common creep deformation fatigue prediction model, as shown in the [117,119,126], whereas the Syed model is less common. The plastic deformation fatigue prediction model focuses on the mechanical parameters of the plastic deformation of solder joints, and this deformation has no positive correlation with time.…”

Section: Jeannettementioning

confidence: 99%

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Survey of Reliability Research on 3D Packaged Memory

Zhou

et al. 2023

Electronics

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As the core carrier of information storage, a semiconductor memory device is a basic product with a large volume that is widespread in the integrated circuit industry. With the rapid development of semiconductor manufacturing processes and materials, the internal structure of memory has gradually shifted from a 2D planar packaging structure to a 3D packaging structure to meet industry demands for high-frequency, high-speed, and large-capacity devices with low power consumption. However, advanced 3D packaging technology can pose some reliability risks, making devices prone to failure, especially when used in harsh environmental conditions, including temperature changes, high temperature and humidity levels, and mechanical stress. In this paper, the authors introduce the typical structure characteristics of 3D packaged memory; analyze the reasons for device failure caused by stress; summarize current research methods that utilize temperature, mechanical and hygrothermal theories, and failure models; and present future challenges and directions regarding the reliability research of 3D packaged memory.

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Section: The Reliability Of Pop Memory Under Thermal Stressmentioning

confidence: 99%

Section: The Reliability Of Pop Memory Under Thermal Stressmentioning

confidence: 99%

Section: The Reliability Of Pop Memory Under Thermal Stressmentioning

confidence: 99%

Section: Jeannettementioning

confidence: 99%

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Survey of Reliability Research on 3D Packaged Memory

Zhou

et al. 2023

Electronics

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“…The use of Cu balls in soldering technology has attracted considerable attention in the field of 3D packaging, [1][2][3][4][5] especially of PoP (Package on Package) to keep gap between top and bottom package, which is shown in Fig. 1.…”

Section: Introductionmentioning

confidence: 99%

Self-alignment Ability of Copper Ball on Soldering for Packaging-on-Packaging and Measurement of Oxidation Layer Thickness by Lightness Value

Kawasaki

Hattori

Roppongi

et al. 2015

Transactions of The Japan Institute of Electronics Packaging

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Cu balls showed unique soldering behavior that was different from the conventional solder as the semiconductor devices.On soldering on pad by the solder balls, solder balls move to the center position because of their self-alignment ability.On the contrary, Cu balls tend to move to the outer position from the mounted center position. We have achieved arranging of Cu balls at the center position using their self-alignment ability. It requires a thin oxidation layer on Cu balls. We also developed the simple and easy method to measure the thickness of the oxidation layers by utilizing the lightness.

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