Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure

Zhang, Zhihao; Wang, Xi-Shu; Ren, Huaihui; She, Jia; Yang, Huihui

doi:10.1016/j.microrel.2017.06.033

Cited by 18 publications

(12 citation statements)

References 22 publications

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“…8–10 For instance, Zhang et al. 11 showed that the maximum inelastic energy is accumulated on the solder balls in the bottom of fine-pitch ball grid array structure. The thermal fatigue initiation also appeared at the corner of solder joints in the electronic packaging.…”

Section: Introductionmentioning

confidence: 99%

“…[3][4][5][6][7] The primary results indicated that solder joints are the most susceptible parts of the electronic assembly under either thermal or mechanical loadings. [8][9][10] For instance, Zhang et al 11 showed that the maximum inelastic energy is accumulated on the solder balls in the bottom of fine-pitch ball grid array structure. The thermal fatigue initiation also appeared at the corner of solder joints in the electronic packaging.…”

Section: Introductionmentioning

confidence: 99%

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Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Ghaderi

Pourmahdavi

Samavatian

et al. 2018

Proceedings of the Institution of Mechanical Engineers, Part L:

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In this work, the combination of vibration loading and thermal cycle effects on the fatigue properties of a solder joint in a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) discrete was investigated. The fatigue mechanism under each loading mode was individually analyzed, and then according to the incremental damage superposition approach, the simultaneous effects were thoroughly studied. Under thermal cycling, the creep behavior of the solder is linked to the fatigue life. In fact, the creep accumulated strain in each thermal cycle has a straight relation to the failure time of solder joint. The origin of stress/strain in the assembly is owing to the sharp difference between coefficients of thermal expansions of the components in the electronic package. Regarding the vibration loading, the root mean square of peeling stress as a widely acceptable failure indicator was used to evaluate the vibration effects on the fatigue life. It is determined that the maximum stress is concentrated at the corner of solder layer. This result was similar to the outcomes of thermal cycling. The results also indicated that the combination of thermal and mechanical loadings accelerates the failure of the solder joint of the power MOSFET. Furthermore, the experimental and simulation studies showed similar results and approved the crack initiation at the corner of solder layer.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Ghaderi

Pourmahdavi

Samavatian

et al. 2018

Proceedings of the Institution of Mechanical Engineers, Part L:

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show abstract

“…The SAC0307-Mn07 solder alloy is significantly softer than SAC305. More rigid joints are less immune to cyclic external load [ 28 ], like vibration or cyclic thermal load, cyclic thermal shock, whereas softer alloys (like the SAC0307-Mn07) can bear better these loads. All in all, the SAC0307-Mn07 samples showed lower shear force in as-reflowed state (testing right after the soldering), but their thermomechanical properties might be better because of the lack of Ag 3 Sn intermetallic plates formation and their softer nature.…”

Section: Resultsmentioning

confidence: 99%

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

et al. 2020

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Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated as SAC0307-Mn07) and those of the traditionally used SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys were investigated by analyzing the shear force and Vickers hardness of reflowed solder balls. During the preparation of the reflowed solder balls, different cooling rates were used in the range from 2.7 K/s to 14.7 K/s. After measuring the shear force and the Vickers hardness, the structures of the fracture surfaces and the intermetallic layer were investigated by SEM (Scanning Electron Microscopy). The mechanical property measurements showed lower shear force for the SAC0307-Mn07 alloy (20–25 N) compared with the SAC305 alloy (27–35 N), independent of the cooling rate. However, the SAC0307-Mn07 alloy was softer; its Vickers hardness was between 12 and 13 HV, whereas the Vickers hardness of the SAC305 alloy was between 19 and 20 HV. In addition, structural analyses revealed rougher intermetallic compound layers in the case of the SAC0307-Mn07 alloy, which can inhibit the propagation of cracks at the solder–substrate interface. These two properties of SAC0307-Mn07 alloy, the softer nature and the rougher intermetallic layer, might result in better thermomechanical behavior of the solder joints during the lifetime of electronic devices.

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“…Their case study on a lead free solder joint validated the damage model. Coffin-Manson method was used to evaluate the solder joints in a package-on-package structure [13]. It was reported that the maximum inelastic hysteresis energy accumulates on the solder joints in the bottom fine-pitch ball grid array structure.…”

Section: Introductionmentioning

confidence: 99%

Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors

Samavatian

Iman‐Eini

Avenas

et al. 2020

IEEE Trans. Power Electron.

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Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure

Cited by 18 publications

References 22 publications

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors

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