2021
DOI: 10.1088/1361-6595/abdae2
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Effects of RF bias frequency and power on the plasma parameters and ash rate in a remote plasma source

Abstract: The effects of the RF bias frequency (2–27.12 MHz) and power (0–50 W) on plasma parameters, i.e., effective electron temperatures, electron densities, and electron energy probability functions (EEPFs), were investigated in a remote plasma source. A small cylindrical Langmuir probe based on the Druyvesteyn method was used for the measurements. When the bias power was changed from 0 W to 10 W for each bias frequency, the electron density decreased and the effective electron temperature increased at a given anten… Show more

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Cited by 6 publications
(1 citation statement)
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“…Semiconductor and display manufacturing industries have advanced significantly in recent decades to define finer patterns while maintaining high productivity. These advances have been supported by technological advances in plasma processes such as ashing [1][2][3][4], cleaning [5][6][7], etching, and deposition studies seeking to understand CCPs based on electrical characteristics [16,17], tailored voltages [18,19], electron heating [20,21], and ion energy [22]. To obtain a desired ion energy and ion flux, many studies have also investigated the effect of driving frequency on CCP characteristics.…”
Section: Introductionmentioning
confidence: 99%
“…Semiconductor and display manufacturing industries have advanced significantly in recent decades to define finer patterns while maintaining high productivity. These advances have been supported by technological advances in plasma processes such as ashing [1][2][3][4], cleaning [5][6][7], etching, and deposition studies seeking to understand CCPs based on electrical characteristics [16,17], tailored voltages [18,19], electron heating [20,21], and ion energy [22]. To obtain a desired ion energy and ion flux, many studies have also investigated the effect of driving frequency on CCP characteristics.…”
Section: Introductionmentioning
confidence: 99%