Effects of NH3, O2, and N2 co-implantation on Cu out-diffusion and antimicrobial properties of copper plasma-implanted polyethylene

In vitro antibacterial evaluation of sol–gel‐derived Zn‐, Ag‐, and (Zn + Ag)‐doped hydroxyapatite coatings against methicillin‐resistant Staphylococcus aureus

“…Bacterial contamination caused by adhesion and colonization on biomaterials surface2 is an important post‐implantation problem and a considered complication of traumatology and orthopedics 3. Despite infection is a common clinical problem and has low incidence,4 its rate of morbidity and mortality is high 4–7…”

“…3 Despite infection is a common clinical problem and has low incidence, 4 its rate of morbidity and mortality is high. [4][5][6][7] Implanted devices have become so many that a bacterial accumulation surrounding implants, called implant-centered infection, is now a costly problem. Such infections are difficult to treat and systemic antibiotics have no efficient efficacy, 8 thereby increasing of health care costs.…”

Applications of plasma-based technology to microelectronics and biomedical engineering

“…Copper is an excellent antimicrobial agent but since it does not bond with the PE matrix, leaching of implanted Cu can be quite fast thereby reducing the long term antibacterial effects. Our recent experiments reveal that gaseous ion co-implantation in concert with Cu PIII can regulate the copper release rate from the substrates and enhance the long term effects [35,36]. In particular, nitrogen co-PIII produces the best results.…”

Enhancing hygiene/antimicrobial properties of polyolefins

“…For instance, silver nanoparticles and copper have been coated on the surface of polymer films or fabrics. To overcome low durability of the antimicrobial functions, plasma treatment with or without gas implantation was employed in coating of copper ions onto polyolefins (Table 8.4) [38,39,46]. In the case of silver nano-sized particles chemical vapor deposition (CVD), solÀgel technique or magnetron sputter coating was used to prepare nanostructured silver films [18,36,37].…”