2009
DOI: 10.1016/j.hydromet.2009.05.017
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Effects of ionic liquid additive [BMIM]HSO4 on copper electro-deposition from acidic sulfate electrolyte

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Cited by 34 publications
(20 citation statements)
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“…The kinetic parameters obtained show that the presence of [BMIM]HSO 4 has an inhibiting efect on the kinetics of the copper discharge process with slight changes in the copper electrodeposition reaction pathway, indicated by the changes in Tafel slopes and the corresponding charge transfer coeicient [21]. A possible mechanism of the action of this additive may .…”
Section: Additives For Copper Electrodepositionmentioning
confidence: 93%
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“…The kinetic parameters obtained show that the presence of [BMIM]HSO 4 has an inhibiting efect on the kinetics of the copper discharge process with slight changes in the copper electrodeposition reaction pathway, indicated by the changes in Tafel slopes and the corresponding charge transfer coeicient [21]. A possible mechanism of the action of this additive may .…”
Section: Additives For Copper Electrodepositionmentioning
confidence: 93%
“…Recently, we have investigated the efect of [BMIM]HSO 4 on copper electrodeposition [21]. Its efects on the morphology of cathodic deposits and the kinetic parameters of the cathodic process were deeply studied.…”
Section: Additives For Copper Electrodepositionmentioning
confidence: 99%
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“…It has been shown that ILs could be advantageous over conventional leveling agents for zinc electrodeposition [16,17]. We have also previously reported on the use of imidazolium- [18] and alkylpyridinium-based [19,20] ILs as additives in copper electrodeposition from acidic sulfate electrolyte. Both these two kinds of ILs are found to function through their adsorption on the cathodic surface, which inhibit the kinetics of the Cu 2?…”
Section: Introductionmentioning
confidence: 97%