The effect of quaternary ammonium-based ionic liquids (ILs) including tetraethylammonium hydrogen sulfate (NEt 4 HSO 4 ) and tetrabutylammonium hydrogen sulfate (NBu 4 HSO 4 ) on copper electrodeposition from acidic sulfate electrolyte was investigated by cyclic voltammetry and chronoamperometric measurements. These ILs were found to have a blocking effect on the copper electroreduction and induced the formation of more leveled and fine-grained cathodic deposits. Analysis of the dimensionless current-time transients indicated that the electrodeposition of copper was involved with instantaneous threedimensional nucleation with diffusion-controlled growth. The addition of ILs induced the instantaneous nucleation to more progressive one. Data obtained from X-ray diffraction spectra revealed that the presence of these ILs strongly affected the crystallographic orientation of the electrodeposited copper with a (220) preferential orientation.
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