The effect of quaternary ammonium-based ionic liquids on copper electrodeposition from acidic sulfate electrolyte

Abstract

The effect of quaternary ammonium-based ionic liquids (ILs) including tetraethylammonium hydrogen sulfate (NEt 4 HSO 4 ) and tetrabutylammonium hydrogen sulfate (NBu 4 HSO 4 ) on copper electrodeposition from acidic sulfate electrolyte was investigated by cyclic voltammetry and chronoamperometric measurements. These ILs were found to have a blocking effect on the copper electroreduction and induced the formation of more leveled and fine-grained cathodic deposits. Analysis of the dimensionless current-time transients indicated that the electrodeposition of copper was involved with instantaneous threedimensional nucleation with diffusion-controlled growth. The addition of ILs induced the instantaneous nucleation to more progressive one. Data obtained from X-ray diffraction spectra revealed that the presence of these ILs strongly affected the crystallographic orientation of the electrodeposited copper with a (220) preferential orientation.

Analysis of Sustainable Methods to Recover Neodymium

“…We recently reported successful electrodeposition of Nd from N-butyl-N-methylpyrrolidinium dicyanamide IL electrolyte at relatively low temperatures (50 • C) under less controlled environments (0.15-4.6 wt% H 2 O) [71]. Similarly, it could be interesting to explore ILs based on phosphorus anions (e.g., phosphite, phosphonate) [78,79] or hydrogen sulphate containing anions [80][81][82], which are considered some of the lowest cost ILs and have shown evidence for successful electrodeposition of other metals (e.g., Cu, Ag) [81,83], although the electrochemical stability for Nd deposition still needs to be assessed.…”

Ionic Liquids as Electrodeposition Additives and Corrosion Inhibitors

“…To be distinguished from alkylimidazolium and alkylpyridinium-based ILs, for which their additive efects were found to come from surface adsorption together with complexing action, quaternary ammonium-based ILs feature their action simply through speciic adsorption [25].…”

“…Some of the most important prosperities of ILs are their thermal stability and avirulence, which make them potential additives for metal electrodeposition and green inhibitors for metal anti-corrosion. In our previous studies, alkylimidazolium, alkylpyridinium and quaternary ammonium-based ionic liquids were observed to be an excellent levelling agent in zinc [18][19][20][21][22] and copper [23][24][25] electrodeposition and showed favourable corrosion resistant on metals such as aluminium [26], copper [27] and mild steel [2].…”

Influence of tetrabutylammonium chloride on the electrodeposition of indium from chloride solution on a glassy carbon electrode

“…To improve the quality of the coatings, it is necessary to add surfactants to the electrolyte, which show have a leveling action in indium electrodeposition. In [18][19][20][21], additions of quaternary ammonium salts were used to inhibit dendritic formation during electrodeposition of zinc, copper and silver; these additives showed a high leveling effect. Formation of compact coatings is possible when surfactants are added to the electrolyte.…”