Effects of Anisotropic Conductive Films (ACFs) Gap Heights on the Bending Reliability of Chip-In-Flex (CIF) Packages for Wearable Electronics Applications

Kim, Jihye; Lee, Tae-Ik; Yoon, Dal-Jin; Kim, Taek‐Soo; Paik, Kyung‐Wook

doi:10.1109/ectc.2017.118

Cited by 3 publications

(2 citation statements)

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“…Furthermore, the bending test setup can be upgraded to a torsion test setup by adding a rotation axis to the moving ends. The push to flex bending setups are more suitable for applications with a thickness of over about 100 µm [ 95 , 99 ].…”

Section: Discussionmentioning

confidence: 99%

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Bending Setups for Reliability Investigation of Flexible Electronics

et al. 2021

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Flexible electronics is a rapidly growing technology for a multitude of applications. Wearables and flexible displays are some application examples. Various technologies and processes are used to produce flexible electronics. An important aspect to be considered when developing these systems is their reliability, especially with regard to repeated bending. In this paper, the frequently used methods for investigating the bending reliability of flexible electronics are presented. This is done to provide an overview of the types of tests that can be performed to investigate the bending reliability. Furthermore, it is shown which devices are developed and optimized to gain more knowledge about the behavior of flexible systems under bending. Both static and dynamic bending test methods are presented.

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Section: Discussionmentioning

confidence: 99%

“…For example, the change in resistance of the structure is monitored as a function of the bending cycles. If the resistance rises above a fixed percentage value compared to the initial resistance during the bending test, this is considered as a failure [ 14 , 94 , 99 ].…”

Section: Bending Machinesmentioning

confidence: 99%