Failure Analysis of Anisotropic Conductive Adhesive Packages in Narrow-Pitch Flip Chip Packaging

Chen, Gui; Wang, Yan; Xiao, Xiaoyu; Yan, Yamei; Wang, Zhu

doi:10.1109/icept52650.2021.9568173

Cited by 2 publications

(4 citation statements)

References 5 publications

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“…Additionally, it obviates the requirement for high pressure to redistribute particles. Based on these considerations, we underscore the significance of this process [2][3][4].…”

Section: Comparison Of This Methods With Existing Technologiesmentioning

confidence: 85%

“…Furthermore, the analysis included an examination of the joints, the morphological characteristics of the cross sections, and the evaluation of mechanical properties. Finally, this study successfully developed a new process with a low temperature (<100 • C) and no pressure, which completely solves the problems associated with high pressures and temperatures in existing technologies [1][2][3][4].…”

Section: Developed a New Technique Called Microfluidic Electroless In...mentioning

confidence: 99%

“…Although the most prevalent technologies currently used in this field include hybrid bonding interconnections, solid-liquid interfacial diffusion, and anisotropic conductive films, all these methods share the common drawback of high pressures and temperatures. These disadvantages can have adverse effects on the surrounding delicate parts [1][2][3][4]. Nonetheless, electroless plating is a promising and viable solution for future chip packaging applications [5].…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications

Huang,

Shih,

Renganathan

et al. 2024

Materials

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This article presents a novel bonding method for chip packaging applications in the semiconductor industry, with a focus on downsizing high-density and 3D-stacked interconnections to improve efficiency and performance. Microfluidic electroless interconnections have been identified as a potential solution for bonding pillar joints at low temperatures and pressures. However, the complex and time-consuming nature of their production process hinders their suitability for mass production. To overcome these challenges, we propose a tailored plating solution using an enhanced copper concentration and plating rate. By eliminating the need for fluid motion and reducing the process time, this method can be used for mass production. The Taguchi approach is first used to optimize the copper–quadrol complex solution with the plating rate and decomposition time. This solution exhibits a copper concentration that is over five times higher than that of conventional solutions, a plating rate of 22.2 μm/h, and a decomposition time of 8 min on a Cu layer substrate. This technique enables Cu pillars to be successfully bonded within 7 min at 35 °C. Planarizing the pillar surface yields a high bonding percentage of 99%. Mechanical shear testing shows a significant fracture strength of 76 MPa.

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“…Additionally, it obviates the requirement for high pressure to redistribute particles. Based on these considerations, we underscore the significance of this process [2][3][4].…”

Section: Comparison Of This Methods With Existing Technologiesmentioning

confidence: 85%

Section: Developed a New Technique Called Microfluidic Electroless In...mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications

Huang,

Shih,

Renganathan

et al. 2024

Materials

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show abstract

“…The curve, in turn, depended on the length and height of the pads, and the distance between them, for a fixed-sized particle. Chen et al have recently modeled the failure probability of ACAs depending on size of bumps and distance between them, and diameter and concentration of CPs [18]. Opening failure and bridging failure are mutually restricted.…”

Section: Concentration Size and Deformation Of Cpsmentioning

confidence: 99%

Conductive Particles in Anisotropic Conductive Films

Goyanes

2022

PSPRJ

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Anisotropic Conductive Films (ACFs) are the major products used for fine-pitch interconnection technology in electronic packaging because of their low incidence in electrical interconnection issues such as high contact resistance and open/short-circuit failure. ACF are conductive adhesives composed of a suitable binder and electrically Conductive Particles (CP). These CP can be selected from a variety of materials to meet specific applications or requirements. In this Mini Review we describe the different types of conductive particles that can be used in ACF, the advantages and disadvantages of each type, as well as other relevant issues such as particle size, concentration, and capture rate. This work could serve as a guide for any group that is interested in research on ACFs.

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Failure Analysis of Anisotropic Conductive Adhesive Packages in Narrow-Pitch Flip Chip Packaging

Cited by 2 publications

References 5 publications

A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications

A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications

Conductive Particles in Anisotropic Conductive Films

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