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2017
DOI: 10.1002/adem.201600607
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Effects of Ag Addition on Hot Deformation Behavior of Cu–Ni–Si Alloys

Abstract: Hot deformation behavior of Cu-Ni-Si and Cu-Ni-Si-Ag alloys is investigated using the Gleeble-1500D simulator in the 600-800 C deformation temperature and 0.01-5 s À1 strain rate ranges. Dynamic recrystallization (DRX) mechanism is a feature of high temperature flow stress-strain curves of the alloy. Microstructure is observed by optical microscopy. Ag addition can refine the grains and accelerate dynamic recrystallization. Characteristic points of the flow stress curves, including critical strain for DRX init… Show more

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Cited by 20 publications
(7 citation statements)
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“…At point II, it is followed by solidification of the Cu + Ni + Si eutectic. After analysis of the results using light microscopy, the presence of small, elongated Ni 2 Si intermetallic phases on the α phase boundaries can probably be observed ( Figure 3 a and Figure 4 , Table 2 ), as well as confirmed by X-ray examinations ( Figure 5 ) [ 1 , 2 , 6 , 7 , 22 ].…”
Section: Resultsmentioning
confidence: 83%
“…At point II, it is followed by solidification of the Cu + Ni + Si eutectic. After analysis of the results using light microscopy, the presence of small, elongated Ni 2 Si intermetallic phases on the α phase boundaries can probably be observed ( Figure 3 a and Figure 4 , Table 2 ), as well as confirmed by X-ray examinations ( Figure 5 ) [ 1 , 2 , 6 , 7 , 22 ].…”
Section: Resultsmentioning
confidence: 83%
“…The hot deformed 760 • C shows smaller grains compared to the reference Cu-Ni-Si alloy [13]. This can contribute to improving the strength after hot deformation according to the Hall-Petch relationship.…”
Section: The True Stress-true Strain Curvementioning
confidence: 88%
“…The softening effect derived from the appearance of dynamic recovery and recrystallization is less than the hardening effect derived from the increase in dislocation density during the deformation process. Compared to the Cu-Ni-Si alloy [13], the addition of Co to the Cu-Ni-Si alloy can restrain dynamic recovery and recrystallization during the hot deformation. The flow stress of the Cu-Ni-Co-Si alloy is much higher than that of the Cu-Ni-Si alloy when the temperature range is 760 to 790 • C and the strain rate is 0.1 to 1 s −1 .…”
Section: The True Stress-true Strain Curvementioning
confidence: 99%
“…According to the dynamic material model, the thermally deformable material can be regarded as a closed system and a deformation dissipater. When the temperature and strain rate is constant, the relationship between plastic deformation dissipation G and recrystallisation dissipation J can be expressed by formula (11) [19,20]:…”
Section: Hot Processing Map Of Cu-65fe-03mg Alloymentioning
confidence: 99%