J Mater Sci: Mater Electron
 2020
DOI: 10.1007/s10854-020-04806-5
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Effects of accelerator in a copper plating bath on interfacial microstructure and mechanical properties of SAC305/Cu solder joints

Xu Han
1
,
Xudong Zhang
2
,
Wenjing Chen
3
et al.
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