Main application limitations of lead-free composite solder doped with foreign reinforcements

Chen, Guang; Wu, Yaofeng

doi:10.1007/s10854-021-06938-8

Cited by 4 publications

(1 citation statement)

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“…Numerous researchers have improved the performance of Sn-based lead-free solders by adding nanoparticles to the solder matrix or through alloying [12]. Various types of nanoparticles are used to modify lead-free solders, including metals particles (such as Al, Co, Ni, Mo, etc.)…”

Section: Introductionmentioning

confidence: 99%

A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

Yu²,

et al. 2023

Metals

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In the electronics industry, graphene is applied with modified lead-free solder. This review presents advances in the preparation, strengthening mechanisms, and property characterization of graphene composite solders. Graphene composite solders are divided into two main categories: unmodified graphene and metal-particle-modified graphene. The unmodified graphene composite solders are classified according to the different solder systems. Metal-particle-modified graphene composite solders are classified according to different metal particles. However, there are still challenges with graphene composite solders. The main challenge is the poor bonding of graphene to the substrate and the nonuniform dispersion. Future directions for the development of graphene composite solders are proposed. They can provide some reference for the development of new graphene composite solders in the future.

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Section: Introductionmentioning

confidence: 99%