Purpose
The purpose of this paper is to investigate the effect of fullerene (FNS) reinforcements on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under isothermal ageing and electrical-migration (EM) stressing.
Design/methodology/approach
In this paper, SAC305 solder alloy doped with 0.1 Wt.% FNS was prepared via the powder metallurgy method. A sandwich-like sample and a U-shaped sample were designed and prepared to conduct an isothermal ageing test and an EM test. The isothermal ageing test was implemented under vacuum atmosphere at 150°C, whereas the EM experiment was carried out with a current density of 1.5 × 104 A/cm2. The microstructural and mechanical evolutions of both plain and composite solder joints after thermal ageing and EM stressing were comparatively studied.
Findings
A growth of Ag3Sn intermetallic compounds (IMCs) in solder matrix and Cu-Sn interfacial IMCs in composite solder joints was notably suppressed under isothermal ageing condition, whereas the hardness and shear strength of composite solder joints significantly outperformed those of non-reinforced solder joints throughout the ageing period. The EM experimental results showed that for the SAC305 solder, the interfacial IMCs formulated a protrusion at the anode after 360 h of EM stressing, whereas the surface of the composite solder joint was relatively smooth. During the stressing period, the interfacial IMC on the anode side of the plain SAC305 solder showed a continuous increasing trend, whereas the IMC at the cathode presented a decreasing trend for its thickness as the stressing time increased; after 360 h of stressing, some cracks and voids had formed on the cathode side. For the SAC305/FNS composite solder, a continuous increase in the thickness of the interfacial IMC was found on both the anode and cathode sides; the growth rate of the interfacial IMC at the anode was higher than that at the cathode. The nanoindentation results showed that the hardness of the SAC305 solder joint presented a gradient distribution after EM stressing, whereas the hardness data showed a relatively homogeneous distribution in the SAC305/FNS solder joint.
Originality/value
The experimental results showed that the FNS reinforcement could effectively mitigate the failure risk in solder joints under isothermal ageing and high-current stressing. Specifically, the FNS particles in solder joints can work as a barrier to suppress the diffusion and migration of Sn and Cu atoms. In addition, the nanoidentation results also indicated that the addition of the FNS reinforcement was very helpful in maintaining the mechanical stability of the solder joint. These findings have provided a theoretical and experimental basis for the practical application of this novel composite solder with high-current densities.
Purpose
The purpose of this paper is to investigate the effect of titanium nitride (TiN) on microstructure and composition of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under a large temperature gradient.
Design/methodology/approach
In this paper, SAC305 lead-free composite solder containing 0.05 Wt.% TiN was prepared by powder metallurgy method. A temperature gradient generator was designed and the corresponding samples were also prepared. The microstructural evolution, internal structure and elemental content of SAC305 and SAC305/TiN solder joints before and after thermal loading were comparatively studied.
Findings
The experimental results show that the addition of the TiN reinforcing phase can effectively inhibit the diffusion and migration of copper atoms and, therefore, affect the distribution of newly formed Cu-Sn IMC in solder joints under the condition of thermal migration (TM). Compared with the SAC305 solder joint, the interconnection interface and internal structure of the composite solder joint after 600 h of TM are also relatively complete.
Originality/value
The TiN reinforcing phase is proven effective to mitigate the TM behavior in solder joints under thermal stressing. Specifically, based on the observation and analysis results of microstructure and internal structure of composite solder joint, the TiN particle can change the temperature gradient distribution of the solder joint, so as to suppress the diffusion and migration of Sn and Cu atoms. In addition, the results of Micro-CT and compositional analysis also indicate that the addition of TiN reinforcement is very helpful to maintain the structural integrity and the compositional stability of the solder joint. Different from other ceramic reinforcements, TiN has good thermo- and electro-conductivity and the thermal-electrical performance of composite solder will not be significantly affected by this reinforcement, which is also the main advantage of selecting TiN as the reinforcing phase to prepare composite solder. This study can not only provide preliminary experimental support for the preparation of high reliability lead-free composite solder but also provide a theoretical basis for the subsequent study (such as electro-thermo distribution in solder joints), which has important application significance.
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