Effecting aging time of epoxy molding compound to molding process for integrated circuit packaging

Abstract

Abstract. This research studied about effecting aging time of epoxy molding compound (EMC) that effect to reliability performance of integrated circuit (IC) package in molding process. Molding process is so important of IC packaging process for protecting IC chip (or die) from temperature and humidity environment using encapsulated EMC. For general molding process, EMC are stored in the frozen at 5°C and left at room temperature at 25 °C for aging time on self before molding of die onto lead frame is 24 hours. The aging time effect to reliability performance of IC package due to different temperature and humidity inside the package. In experiment, aging time of EMC were varied from 0 to 24 hours for molding process of SOIC-8L packages. For analysis, these packages were tested by x-ray and scanning acoustic microscope to analyze properties of EMC with an aging time and also analyzed delamination, internal void, and wire sweep inside the packages with different aging time. The results revealed that different aging time of EMC effect to properties and reliability performance of molding process. IntroductionEncapsulation of epoxy molding compound (EMC) for molding process is a popular method for integrated circuit (IC) packaging manufacturing. Molding is the process for protecting die or chip of IC package form external environment for chemical reaction and mechanical damage by shaping EMC continuing with the formation of a gelatin with complete cross linked network and leading finally to the fully cured thermoset. EMC is thermosetting polymer which is materials with cross linked polymer chains and no melting temperature after they are cured. EMC is a mixture of an epoxy resin, a filler (silica, SiO2), a hardener, and other additives. The important part of EMC which is epoxy resin functions as an adhesive and binder. For silica filler part, this part is the largest portion of EMC provides excellent mechanical strength and a thermal dispersion. Properties of these components effect to reliability performance of IC package. From normal manufacturing process, the EMC is stored in the frozen at 5 °C and aging at around room temperature before molding process. The EMC aging effect to its properties and reliability performance of IC package.Therefore, this research interested in studying effecting of aging time to epoxy molding compound (EMC) in term of reliability performance for integrated circuit (IC) package in range from 0 hour to 24 hours and analyze properties of EMC with aging time and also study about quality and reliability

A Sliding-Window Principal Component thermography reconstruction approach for enhancement and identification of electronic components internal structure

“…To further validate the proposed method, simulation modelling is employed to predict the thermal signal of PT for ECs [27]. The simulation signals are then processed with the proposed method to demonstrate its ability to detect the layouts of die and lead frame.…”

“…Another promising method is Principal Component Thermography (PCT) [25,26] that uses Principal Component Analysis (PCA) in a 3D thermographic image sequence. The timedomain feature from PCA has been used for counterfeit identification in ECs [22,27,28]. PCT is a statistical tool used for identification of specific image patterns in thermograms, depicting similarities and differences of specific patterns by decomposing data to singular modes.…”

Quantitative mapping of high modulus materials at the nanoscale: comparative study between atomic force microscopy and nanoindentation

“…Then for this thermosetting polymer, in addition to the composition of the polymer matrix, a good combination of chemical, thermal, electrical and mechanical properties (Liu et al, 2004;Tsai et al, 2006) must be optimised to reach the maximum of packaging target properties. Two main aspects must be considered: the specific properties of the material (Bae et al, 2004;Zhang & Wong, 2004) but also the reliability of the package (Lu et al, 2009;Noijen et al, 2009;Tachapitunsuk et al, 2017;Oh et al, 2019) in contact with the semiconductor chip (Gan et al, 2014). Usually, the epoxy material is used for its good fluidity (Linec & Mušič, 2019), curing property and the capability to design integrated 3D shapes.…”

Detectability evaluation of attributes anomaly for electronic components using pulsed thermography

“…Broken interior leads or wires may lead to low performance or partial malfunctions counterfeit [15]. Aged or over usage life counterfeits would often incur package material degradation in either the mould compound or die, caused by long-term thermal fatigue cycles [16]. Figure 2(b) presents a comparison between an authentic and a counterfeit EC in X-Ray images.…”