Effect of wire diameter and hook location on second bond failure modes

Abstract

Purpose -This paper aims to analyze the effect of Au wire size and location of hook during wire pulling test to identify the variation of results obtained. Design/methodology/approach -Two hook locations, namely, location A and location B were used to analyze the effect of hook location. Location A was the same as the hook location required by MIL-STD-883E standard, whereas location B was located near to the second bond. The correlation between new purposed failure modes and MIL-STD-883E standard was developed to reflect on the pull strength with the physical failure. Findings -It was observed that fine pitch Au wire has higher variation and lower process capability of pull strength. Au wire pulled by the hook at location B provides a more representative result compared to that at location A. Fifty per cent or more of Au remnant is required to be considered as a good and reliable Au wedge bond based on the new purposed failure modes. Originality/value -The evaluation of gold (Au) wedge bond requires a new proper wire pulling test method. This is due to the large variation obtained from the application of current practice of wire pulling test.Azman Jalar can be contacted at: azmn@ukm.my For instructions on how to order reprints of this article, please visit our website: www.emeraldgrouppublishing.com/licensing/reprints.htm Or contact us for further details: permissions@emeraldinsight.com

Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds

“…Thirty readings of wire pulling test was carried out using Dage 2400 wire pull tester to evaluate the wire pull strength or the bondability of Au wedge bond. The approach used to conduct wire pulling test was based on the preliminary study that has been performed by Harun et al (2015). The difference between Harun et al (2015) approach with the conventional wire pulling test such as American Society for Testing and Materials (ASTM) F459-06 standard is that the location of the hook is located near the second bond or wedge bond as shown in Figure 3.…”

“…The approach used to conduct wire pulling test was based on the preliminary study that has been performed by Harun et al (2015). The difference between Harun et al (2015) approach with the conventional wire pulling test such as American Society for Testing and Materials (ASTM) F459-06 standard is that the location of the hook is located near the second bond or wedge bond as shown in Figure 3. It was found that by using the method of wire pulling test as shown in Figure 3, the results obtained are more consistent and reliable as compared to that of conventional method of ASTM F459-O6 standard (Harun et al, 2015).…”

Effects of electrolyte towards copper wire metallurgical interconnection in semiconductor

“…The best wire material for wire bonding technology probably is gold wire, as it provides a good bonding process and reliability performance [1][2][3]. However, the packaging industry is searching for an alternative material for wire bonding [4].…”