Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds

Zulkifli, Muhammad Nubli; Harun, Fuaida; Jalar, Azman

doi:10.1108/mi-08-2018-0053

Cited by 12 publications

(4 citation statements)

References 26 publications

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“…Ultrasonic-assisted soldering is a quick, clean and effective method in the field of electronic packaging. Nowadays, ultrasonic soldering technology has aroused ever-increasing attention and intense efforts (Zulkifli et al, 2019). Especially in electronic packaging industry, research mainly focus on metal substrates such as Al (Guo et al, 2017), Cu (Gan et al, 2019), ceramic materials igure 2 Soldering seam of joints by different ultrasonic loading degrees (Kolenak et al, 2021) or soldering of metals and ceramics (Yi et al, 2022;Li et al, 2022a).…”

Section: Introductionmentioning

confidence: 99%

Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees

Huang

Gan

Liu

et al. 2023

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Purpose This paper aims to investigate the effects of different ultrasonic-assisted loading degrees on the microstructure, mechanical properties and the fracture morphology of Cu/Zn+15%SAC0307+15%Cu/Al solder joints. Design/methodology/approach A new method in which 45 μm Zn particles were mixed with 15% 500 nm Cu particles and 15% 500 nm SAC0307 particles as solders (SACZ) and five different ultrasonic loading degrees were applied for realizing the soldering between Cu and Al at 240 °C and 8 MPa. Then, SEM was used to observe and analyze the soldering seam, interface microstructure and fracture morphology; the structural composition was determined by EDS; the phase of the soldering seam was characterized by XRD; and a PTR-1102 bonding tester was adopted to test the average shear strength. Findings The results manifest that Al–Zn solid solution is formed on the Al side of the Cu/SACZ/Al joints, while the interface IMC (Cu5Zn8) is formed on the Cu side of the Cu/SACZ/Al joints. When single ultrasonic was used in soldering, the interface IMC (Cu5Zn8) gradually thickens with the increase of ultrasonic degree. It is observed that the proportion of Zn or ZnO areas in solders decreases, and the proportion of Cu–Zn compound areas increases with the variation of ultrasonic degree. The maximum shear strength of joint reaches 46.01 MPa when the dual ultrasonic degree is 60°. The fracture position of the joint gradually shifts from the Al side interface to the solders and then to the Cu side interface. Originality/value The mechanism of ultrasonic action on micro-nanoparticles is further studied. By using different ultrasonic loading degrees to realize Cu/Al soldering, it is believed that the understandings gained in this study may offer some new insights for the development of low-temperature soldering methodology for heterogeneous materials.

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Section: Introductionmentioning

confidence: 99%

Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees

Huang

Gan

Liu

et al. 2023

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“…This completes the welding of the first solder joint; generally, the height of the welding ball welded by this process is 2–3 times the wire diameter. The factors that affect the quality of welding points are ultrasonic power, contact time, welding pressure, and hot table temperature [ 18 , 19 , 20 , 21 , 22 ], all of which need to be adjusted to maximize the welding quality.…”

Section: Introductionmentioning

confidence: 99%

Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment

Wang

Liu

et al. 2022

Micromachines

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The long-term application of sensors in a high-temperature environment needs to address several challenges, such as stability at high temperatures for a long time, better wiring interconnection of sensors, and reliable and steady connection of the sensor and its external equipment. In order to systematically investigate the reliability of thin coatings at high temperatures for a long time, Au and Cr layers were deposited on silicon substrates by magnetron sputtering. Additionally, samples with different electrode thicknesses were annealed at different temperatures for a varied duration to study the effect of electrode thickness, temperature, and duration on the reliability of samples. The results of tensile and probe tests before and after heat treatment revealed that the mechanical strength and electrical properties have changed after annealing. In addition, the bonding interface was analyzed by a cross-sectional electron microscope. The analysis showed that long-term continuous high-temperature exposure would result in thinning of the electrode, formation of pores, recrystallization, and grain growth, all of which can affect the mechanical strength and electrical properties. In addition, it was observed that increasing the thickness of the gold layer will improve reliability, and the test results show that although the thin metal layer sample is in poor condition, it is still usable. The present study provides theoretical support for the application of thin coatings in high temperatures and harsh environments.

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“…Wire bonding technology is considered the most crucial step in establishing the structure and functionality interconnection between chips and substrates of microelectronic packages. Gold (Au) wire has been serving this wire bonding technology for decades due to its excellent workability and stable chemical properties [1,2]. However, the rise of the gold price has motivated the research and development activity to look for alternative wire materials such as silver (Ag), Aluminium (Al), and copper (Cu) [3][4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages

Hamid¹,

Badarisman²,

Jalar

et al. 2022

J. Phys.: Conf. Ser.

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Copper wire bonding has got attracted attention over gold wire bonding due to its lower cost. However, despite many unique aspects and properties of copper wire bonding, corrosion of copper wire bonding has become a point of interest as it leads to the failure of semiconductor packages. Current and future trends and development in miniaturization and multifunction of the semiconductor packages show semiconductor manufacturers to establish good wire bonding with high reliability. However, this trend becomes a significant challenge in respect of corrosion occurrence. Several studies on the corrosion of copper wire bonding; however, there is no considerable study in the integrated factors leading to corrosion. Therefore, this paper focuses on investigating the corrosion phenomena of wire copper wire bonding, especially wedge bonds. This paper use a combination of the problem-solving approach for a complex problem. The analysis suggested that the weightage of factors, depending on process parameters and process steps, play a particular role in facilitating or preventing corrosion on the copper wire bonding. Therefore, it is essential to consider these factors when designing assembly process steps and parameters to control corrosion in semiconductor packages.

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Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds

Cited by 12 publications

References 26 publications

Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees

Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees

Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment

Investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages

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