Temperature Dependence of Elastic–Plastic Properties of Fine-Pitch SAC 0307 Solder Joint Using Nanoindentation Approach

Jalar, Azman; Bakar, Maria Abu; Ismail, Roslina

doi:10.1007/s11661-019-05614-1

Cited by 20 publications

(7 citation statements)

References 30 publications

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“…The printed PCB was then reflowed in the reflow oven for the soldering process to establish the solder joint. 38,39 The samples were then subjected to annealing during high-temperature storage (HTS) testing in an oven at 150°C for 200, 400, 600, 800, 1000, 1200, 1400, 1600, 1800, and 2000 h to facilitate IMC layer growth. Each sample was taken out of the oven at every interval HTS time and prepared for cross-section via standard metallographic technique, involving the cutting process, grinding process, and polishing process.…”

Section: Methodsmentioning

confidence: 99%

“…40,41 The samples were cut using a sawing machine (Buehler, Isomet 1000), cold mounted in a mixture of epoxy resin and hardener, grounded (PM-1V) with SiC abrasive paper from 800, 1000, 1200, 2000, and 4000 grit with a speed of 50–100 rpm, and polished (PM-1V) using Dp-Nap polishing cloth and diamond sprays of 6 and 1 µm with a speed of 50 rpm. The microstructure of the solder joint, which consists of Cu substrate, IMC layer, and solder matrix, was observed and analysed qualitatively and quantitatively using focus variation microscopy (Alicona, G4) 38,42 and a field emission scanning electron microscope equipped with energy dispersive spectroscopy (ZEISS, MERLIN COMPACT) for morphology and elemental characterisation. The average IMC layer thickness has been estimated from 300 measurement points for each HTS time.…”

Section: Methodsmentioning

confidence: 99%

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Linear growth behaviour of intermetallic compound layer in electronic interconnections

Bakar,

Jalar,

Alias

2024

Science and Technology of Welding and Joining

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We observed a linear behaviour of intermetallic compound (IMC) layer growth in electronic metallurgical interconnections, although the time required was twice that of commercial reliability standards for electronic packaging. This finding contradicts the classical parabolic growth law, which is widely reported to represent growth behaviour. We suggest that the parabolic growth law may be inadequate to thoroughly explain the IMC layer's growth by considering (a) one-directional growth and (b) reactions between elements for formation and growth. Further analysis has been carried out to analyse the logical judgment of the parabolic growth law and support our finding over linear IMC layer growth behavior.

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Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Linear growth behaviour of intermetallic compound layer in electronic interconnections

Bakar,

Jalar,

Alias

2024

Science and Technology of Welding and Joining

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“…A pull tester was used to separate the BGA components from the PCB pads. The BGA components were examined for dye indications using a Nikon Eclipse LV150NL optical microscope 32 .…”

Section: Methodsmentioning

confidence: 99%

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

Ismail

Bakar

Ehsan

et al. 2022

Sci Rep

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This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball grid array components and their solder joints on double-sided printed circuit board assembly. Three types of heat shield placement locations were used: sample X, individual heat shield placement on adjacent components of the rework location; sample Y, a U-shaped, and sample Z, a square-shaped heat shield placed respectively at the heat source location. The dye and pull test results, infrared thermography, and temperature measurements were analysed to understand the relationship between the location of the heat shield and solder joint damage during rework. Heat shield placement at the heat source location on the reworked component can reduce the peak temperatures on the adjacent rework component locations by up to 8.18%. The peak temperatures of the centre and corner of the BGA component can be maintained below 195 °C and 210 °C, respectively to improve the adjacent rework component locations' solder joint quality by reducing solder joint damage by more than 50% solder cracks. This is useful for thermal management during rework involving high-density ball grid array component placements on double-sided printed circuit board assembly.

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“…To study such relationships, characterization of solder materials on a small scale is necessary to determine the reliability of electronic packaging. Previous studies have used conventional methods in obtaining the mechanical properties of solder alloys namely microhardness test, shear test, impact test, Vickers test, bending test and tensile test [6]. A study of mechanical properties of SAC solder alloys using Vickers method by making indentations on the solder area and substrate area have been reported [7].…”

Section: Introductionmentioning

confidence: 99%

Effect of 60% thickness reduction of Sn-Cu solder alloy on localized micromechanical properties via nanoindentation approach

Yusoff

Bakar

Jalar

2022

J. Phys.: Conf. Ser.

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The relationship between a process and mechanical properties are important in understanding the behaviour of a material under certain conditions. This indicate that mechanical properties of the materials can be modified through certain processing. Hence, this paper investigates the effect of 60% thickness reduction of Sn-Cu alloy in thermomechanical treatment on the localized micromechanical properties. A bar-shape of Sn-Cu solder alloy is subjected to heat treatment at 30°C, 60°C, 90°C, 120°C and 150°C for 20 minutes, followed by 60% thickness reduction via compression process. Sample without compression process was used as control sample. Nanoindentation approach was used to characterize the localized micromechanical properties of the samples. The results show the hardness value for control samples reduced approximately 56%, from 181 MPa at 30°C to 79 MPa at 150°C. Reduced modulus of control sample has shown similar decreasing trend from 149 GPa at 30°C to 85 GPa at 150°C, approximately 43% changes. Lower changes in hardness and reduced modulus observed for thermomechanical treated sample approximately 20% and 18%, respectively. These findings show that thermomechanical treatment has given significant effect on the localized micromechanical properties of Sn-Cu solder alloy.

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Temperature Dependence of Elastic–Plastic Properties of Fine-Pitch SAC 0307 Solder Joint Using Nanoindentation Approach

Cited by 20 publications

References 30 publications

Linear growth behaviour of intermetallic compound layer in electronic interconnections

Linear growth behaviour of intermetallic compound layer in electronic interconnections

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

Effect of 60% thickness reduction of Sn-Cu solder alloy on localized micromechanical properties via nanoindentation approach

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