Effect of the die edge and multiple delaminations on the mechanics of delamination in a PQFP

Ho, Siow Ling; Yu, Jiyin; Tay, A.A.O.

doi:10.1109/ectc.2010.5490890

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) 2010

DOI: 10.1109/ectc.2010.5490890

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Effect of the die edge and multiple delaminations on the mechanics of delamination in a PQFP

Siow Ling Ho

Jiyin Yu

A.A.O. Tay

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Cited by 3 publications

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Effect of the die edge and multiple delaminations on the mechanics of delamination in a PQFP

Cited by 3 publications

References 13 publications

A numerical analysis of penny-shaped delaminations in an encapsulated silicon module

A numerical analysis of penny-shaped delaminations in an encapsulated silicon module

Interaction of multiple delaminations in a PQFP

Die Pad Delamination on QFN Package

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