2011 IEEE 61st Electronic Components and Technology Conference (ECTC) 2011
DOI: 10.1109/ectc.2011.5898649
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A numerical analysis of penny-shaped delaminations in an encapsulated silicon module

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Cited by 1 publication
(2 citation statements)
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“…where x 01 = x Q 2 d 0 . A further 26 conditions can be derived between (1q) and (1a), these are similar to those in (52), therefore these are not presented here. We have 24 + 24 + 26 + 26 = 100 conditions altogether.…”
Section: Boundary and Continuity Conditionsmentioning
confidence: 99%
See 1 more Smart Citation
“…where x 01 = x Q 2 d 0 . A further 26 conditions can be derived between (1q) and (1a), these are similar to those in (52), therefore these are not presented here. We have 24 + 24 + 26 + 26 = 100 conditions altogether.…”
Section: Boundary and Continuity Conditionsmentioning
confidence: 99%
“…[14,15]) and changes the dynamic properties significantly, and therefore has a major influence on the lifetime of the structure. The delamination behavior of composite materials is characterized by different specimens for mode-I [16][17][18][19][20][21][22][23], mode-II [24][25][26], mixed-mode I/II [27][28][29][30][31][32][33][34][35][36][37], mode-III [38][39][40][41][42][43][44][45][46][47][48], mixed-mode I/III [49] mixed-mode II/III [42,[50][51][52][53][54][55][56][57][58][59] and mixed-mode I/II/III [60][61]…”
Section: Introductionmentioning
confidence: 99%