2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) 2018
DOI: 10.1109/iemt.2018.8511797
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Die Pad Delamination on QFN Package

Chong Chee Chiew1,
Paing Samsun2,
Letcheemana Vigneswaran3
et al.
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Cited by 4 publications
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Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages

Shih,
Liu,
Lin
et al. 2023
Exp Tech
2
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Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages

Shih,
Liu,
Lin
et al. 2023
Exp Tech
2
0
0
0
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Development of an Innovative Leadframe Design for Eliminating Lead Delamination

Cadag
1
,
Talledo
2
,
Cadag
3
2021
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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Investigation and Optimization of Mold Flow Impact to Leadless SMD Package Delamination

Li1,
Garete2,
Chan3
et al. 2021
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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