Effect of surface roughness on the adhesion of electrolessly plated platinum to poly(ethylene terephthalate) films

Chong, Eugene; Stevens, Michael G.; Nissen, K. E.

doi:10.1080/00218460309577

Cited by 8 publications

(3 citation statements)

References 13 publications

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“…As shown in Table 3 , the surface roughness of the bottom of the channel along the channel direction was 0.30 µm and of the glass surface was 0.01 µm in Ra value. As previously noted, a copper metal layer and sufficient surface roughness enhance the deposited copper’s durability with an anchor effect [ 27 , 28 , 29 ]. Based on previous research, the anchor effect, caused by roughness, is confirmed when the Ra exceeds 0.1 µm [ 14 ].…”

Section: Resultsmentioning

confidence: 98%

“…Figure 10 a,b show the copper wires on the surface of the glass being detached by ultrasonic vibration. As there were no prior treatments, such as making the surface rough by LIBWE, the adhesion between the glass surface and the deposited copper wire was relatively weak [ 14 , 28 ]. If the copper wire easily detaches from the substrates, as in this experiment, it would be more likely to fail in industrial applications.…”

Section: Resultsmentioning

confidence: 99%

“…As laser energy constantly heats up the absorbent and deposited copper, glass is repeatedly removed from the glass substrate until reaching the goal depth [ 24 ]. LIBWE could therefore function as a pre-treatment process for glass because the created rough surface can offer anchor effect and the thin deposited layer of metal can offer additional adhesion force for further copper deposition [ 27 , 28 , 29 ].…”

Section: Principlesmentioning

confidence: 99%

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Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods

et al. 2020

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Glass is a well-known non-conductive material that has many useful properties, and considerable research has been conducted into making circuits on glass. Many deposition techniques have been studied, and laser-induced chemical liquid phase deposition (LCLD) is a well-known and cost-effective method for rapid prototyping of copper deposition on glass. However, the deposition results from the LCLD method on the surface of glass, which shows an issue in its detachment from the substrates because of the relatively low adhesion between deposited copper and the nontreated glass surface. This problem undermines the usability of deposited glass in industrial applications. In this study, the laser-induced backside wet etching (LIBWE) method was performed as a preceding process to fabricate microchannels, which were filled with copper by LCLD. Additional durable copper wire was produced as a result of the enhanced adhesion between the glass and the deposited copper. The adhesion was enhanced by a rough surface and metal layer, which are characteristics of LIBWE machining. Furthermore, the proposed method is expected to broaden the use of deposited glass in industrial applications, such as in stacked or covered multilayer structures with built-in copper wires, because the inserted copper can be physically protected by the microstructures.

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Section: Resultsmentioning

confidence: 98%

Section: Resultsmentioning

confidence: 99%

Section: Principlesmentioning

confidence: 99%

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Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods

et al. 2020

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Ink‐Jet Printing, Self‐Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature

Cheng¹,

Mo-hua²,

Chiu³

et al. 2005

Macromol. Rapid Commun.

171

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Summary: The driving forces behind the development of flexible electronics are their flexibility, lightweightedness, and potential for low‐cost manufacturing. However, because of physical limitations, traditional thermal processes cause deformations in the flexible substrate. As a result, the adhesion quality of the printed wires is deteriorated. This article reviews recent developments in printing circuits on a flexible substrate by combining self‐assembled polyelectrolytes, ink‐jet printing of a catalyst, and electroless plating of metals. The limitations and potential applications of this technology are also discussed. Experiments implementing this technology demonstrated significant results. By a vibration‐induced assistance during an ink‐jet printing catalyst process, line width and blurring can be controlled to within ±3% variation. Following the IPC 6013 standard for flexible electronics, the results after thermal cycling (288 °C, 6 times) and a hot oil test (260 °C, 3 times) indicated that the metallic circuit had retained excellent adhesion properties and electric characteristics. We also report the first successful demonstration of a metal film in a via‐hole inner wall on a flexible substrate. This novel fabrication method is ideal for the realization of large area, flexible electronics and future multilayer flexible substrate application, such as flexible display, chip on flexible substrate, etc., particularly where traditional lithographic processes can not be applied.Flexible high‐density circuit on an FR‐4 substrate (left) and picture of via hole with copper inner wall (right).magnified imageFlexible high‐density circuit on an FR‐4 substrate (left) and picture of via hole with copper inner wall (right).

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Characterisation of the Mechanical Bond Strength for Copper on Glass Plating Applications

Petzing

Webb

et al. 2013

Characterisation of Areal Surface Texture

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Effect of surface roughness on the adhesion of electrolessly plated platinum to poly(ethylene terephthalate) films

Cited by 8 publications

References 13 publications

Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods

Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods

Ink‐Jet Printing, Self‐Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature

Characterisation of the Mechanical Bond Strength for Copper on Glass Plating Applications

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