Effect of surface finish material on printed circuit board for electrochemical migration

Noh, Bo‐In; Lee, Jong-Bum; Jung, Seung‐Boo

doi:10.1016/j.microrel.2007.09.006

Cited by 63 publications

(25 citation statements)

References 9 publications

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“…Noh et al [27] found that the tendency for ECM followed the same trend as the rate of corrosion on materials such as electroless Ag, electroplated Sn, and ENIG (electroless nickel on immersion gold) surfaces when comparing ECM experiments using DI water to corrosion experiments in 1.0 wt.% NaCl solutions and that the tendency for ECM for various metals was in the order Ag > Sn > ENIG. In this paper, however, it is found that the dissolution rate at the anode under ECM conditions plays a significant role on whether ECM is possible or not.…”

Section: Discussionmentioning

confidence: 97%

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Minzari

Jellesen

Møller

et al. 2009

IEEE Trans. Device Mater. Relib.

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Abstract-Electrochemical migration behavior of end terminals on ceramic chip resistors (CCRs) was studied using a novel experimental setup in varying sodium chloride concentrations from 0 to 1000 ppm. The chip resistor used for the investigation was 10-kΩ CCR size 0805 with end terminals made of 97Sn3Pb alloy. Anodic polarization behavior of the electrode materials was investigated using a microelectrochemical setup. Material makeup of the chip resistor was investigated using scanning electron microscopy (SEM)/energy dispersive spectroscopy and focused-ion-beam SEM. Results showed that the dissolution rate of the Sn and stability of Sn ions in the solution layer play a significant role in the formation of dendrites, which is controlled by chloride concentration and potential bias. Morphology, composition, and resistance of the dendrites were dependent on chloride concentration and potential.

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Section: Discussionmentioning

confidence: 97%

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Minzari

Jellesen

Møller

et al. 2009

IEEE Trans. Device Mater. Relib.

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“…It must be also mentioned the even newer publications reported that nickel follows the classical ECM model [18][19]. So, as it was shown in case of gold, the ECM literature of nickel is also very contradictory.…”

Section: Ohmentioning

confidence: 98%

Electrochemical migration of Ni and ENIG surface finish during Environmental test contaminated by NaCl

Medgyes

2017

J Mater Sci: Mater Electron

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The electrochemical migration (ECM) mechanism occurs at the presence of moisture in the case of operating circuits and results in shorts (dendrites) between adjacent conductor lines/traces. Dendrite growth occurs as a result of metal ions being dissolved into a solution from the anode and deposited at the cathode, thereby growing in tree-like formations. In this study the water condensation process and ECM behavior of Nickel (Ni), Electroless Nickel Immersion Gold (ENIG) and pure copper were investigated using Thermal Humidity and Bias (THB) test in NaCl environment. The THB results show that Cu has higher ECM resistance than Ni and ENIG surface finishes, which was an unexpected result. The main influencing factors of the water condensation (e.g.: surface roughness, thermal parameters) and the ECM processes (precipitates and dendrites) were investigated and discussed in details. Furthermore, a novel ECM model for Ni and NiAu surface finish was established using THB test in case NaCl contaminated samples.

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“…In this study, the behaviors and susceptibilities of ECM of four specific Ag-In alloys and two pure silver materials were examined via the water drop test (WDT) in deionized water and applied electric field. The WDT is a commonly used accelerated testing method for the measurement of ECM resistance [1][2][3][4][5][6][7][13][14][15][16]. The compositions of all the tested samples are: Ag, Ag-In solid solutions with 10 at.% In and 19 at.% In (which will be denoted as (Ag)-10In and (Ag)-19In in the following article), Ag 3 In and Ag 9 In 4 , as labeled in the Ag-In binary phase diagram in Fig.…”

Section: Introductionmentioning

confidence: 99%

Analyses and design for electrochemical migration suppression by alloying indium into silver

Yang

Lee

et al. 2018

J Mater Sci: Mater Electron

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Silver electrochemical migration (ECM) is a serious reliability issue for fine pitch as well as power electronic devices that employ silver as interconnection materials. In this study, a method to suppress the ECM behavior of silver was proposed and implemented. Solid solutions of Ag-In and intermetallic compounds were fabricated and their ECM properties were studied through the water drop test (WDT). The WDT was performed on alumina substrate in deionized water at 3 V, where the leakage current was measured. The results show that Ag-In alloy samples have considerably longer lifetime before reaching short circuit than pure silver samples. As indium concentration in Ag-In solid solution increases, the resistance to ECM also increases. The migration process is completely inhibited when the indium concentration reaches 19 at.%. The morphologies of the dendrites and surfaces of the anode and cathode were also investigated. A model was established to explain the anti-ECM mechanism of Ag-In alloys. By forming indium oxide on the surface of the anode under electric field in a humid environment, the anode gets passivated and the silver dissolution path is completely blocked, and thus inhibiting the ECM process. It was discovered that the quality of electrode surfaces is essential in realizing the full potential of the inherent anti-ECM ability of Ag-In alloys. In conclusion, the results of this investigation have shown that Ag-In alloys can be promising and valuable candidates for conductors, metallization, and interconnect materials in fine pitch and high power electronic devices.

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Effect of surface finish material on printed circuit board for electrochemical migration

Cited by 63 publications

References 9 publications

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Electrochemical migration of Ni and ENIG surface finish during Environmental test contaminated by NaCl

Analyses and design for electrochemical migration suppression by alloying indium into silver

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