2016
DOI: 10.7567/apex.9.051001
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Effect of stress on the Al composition evolution in AlGaN grown using metal organic vapor phase epitaxy

Abstract: Two series of AlGaN samples with different stresses were designed to investigate the effect of stress on the Al composition. X-ray diffraction reciprocal space mapping (XRD RSM) demonstrated that the AlGaN epilayers with different stresses have large Al composition differences despite the same growth conditions. The largest Al composition difference reached up to 21.3%, which was also confirmed using secondary ion mass spectroscopy (SIMS). This result is attributed to a large stress discrepancy in the AlGaN ep… Show more

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Cited by 8 publications
(12 citation statements)
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“…Recently, some researches have demonstrated that during the growth of AlGaN layer, strong compressive strain can pull Ga atom from the AlGaN epilayer to reduce the strain energy, leading to the growth of AlGaN alloy with high Al content [ 23 , 38 ]. As an analogy, if there exists a strong tensile strain field, Al atom may also be pulled out from AlGaN, resulting in a higher Ga composition.…”
Section: Resultsmentioning
confidence: 99%
“…Recently, some researches have demonstrated that during the growth of AlGaN layer, strong compressive strain can pull Ga atom from the AlGaN epilayer to reduce the strain energy, leading to the growth of AlGaN alloy with high Al content [ 23 , 38 ]. As an analogy, if there exists a strong tensile strain field, Al atom may also be pulled out from AlGaN, resulting in a higher Ga composition.…”
Section: Resultsmentioning
confidence: 99%
“…Experimentally, lattice relaxation has been assessed by X-ray diffraction (XRD) measurements in many heterosystems, including Al x Ga 1−x N/AlN. [5][6][7][8][9][10][11][12][13][14] Interestingly, experimentally determined CLTs greatly exceed the theoretical predictions. [5][6][7][8][9][10][11] Figure 1 summarizes the reported lattice relaxations in Al x Ga 1−x N/AlN (0001) heterostructures assessed by XRD reciprocal space mapping (RSM).…”
mentioning
confidence: 99%
“…The compressive stress is as large as 1.3-1.5 GPa, which can be calculated based on the Raman spectra and thermal expansion coefficient [82,83]. The excess compressive stress may cause the deterioration of surface morphology, unwanted wafer bowing, and severe composition pulling effects, which should be controlled in a proper range [84][85][86][87][88]. Additionally, impurities from the graphite susceptor and chamber are easily incorporated into the AlN epilayer at the annealing temperature.…”
Section: High Temperature Annealing (Hta)mentioning
confidence: 99%