Effect of Specimen Size on Toughness Evaluation by Charpy Test

Abstract

Herein we present an experimental investigation on the toughness evaluation method for the samples of copper and aluminum, which are generally employed as electronic equipment parts, through the miniaturized version of the Charpy impact test. Overall, the resulting high reproducibility of the absorbed energy values informed by the miniaturized Charpy impact test can be witnessed; moreover, it is possible to compare the values given by the Japanese industrial standard (JIS) Charpy impact test to those given by the miniaturized Charpy impact test and correction factors were calculated accordingly. [

Recent Development of Joining and Conductive Materials for Electronic Components

“…130) By applying a miniaturized Charpy impact test to evaluate the toughness of small Cu and Al samples, it was confirmed that high reproducibility was obtained. 22)…”

“…6). 17) The issue introduces research related to electronic materials: evaluations of mechanical properties of solder alloys 1821) and metal materials used in electronic equipment parts, 22) investigation of intermetallic compounds formed on bonding wires, 23) development of resin materials, 24) and evaluations of fatigue properties of sintered materials, 25) solder alloys 26) and underfill resin. 27) From these special issues, there are 18 researches on joining materials and 4 researches on conductive materials, which shows the importance of these materials.…”