Effect of SiCw volume fraction and cold pressure on microstructure and mechanical properties of aluminum matrix composites

Xu, Xiaojing; Ze, Jiang; Tabie, Vitus Mwinteribo; Mao, Qiang; Zhang, Tianci; Cheng, Hao; Liu, Qingjun; Zhang, Xu; Liu, Yangguang; Xiao, Yishui; Wang, Hao

doi:10.1088/2053-1591/ab5b48

Cited by 6 publications

(1 citation statement)

References 22 publications

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“…SiCw is widely used as reinforcement. Xu Zhang et al [ 34 ] prepared SiCw/Al composites by hot isostatic pressing process. Tayebi M et al [ 35 ] prepared SiCw/Mg composites by stir casting.…”

Section: Current Status Of Metal-based Electronic Packaging Materialsmentioning

confidence: 99%

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

Lai

Niu

et al. 2023

Micromachines

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With the advancement of semiconductor technology, chip cooling has become a major obstacle to enhancing the capabilities of power electronic systems. Traditional electronic packaging materials are no longer able to meet the heat dissipation requirements of high-performance chips. High thermal conductivity (TC), low coefficient of thermal expansion (CTE), good mechanical properties, and a rich foundation in microfabrication techniques are the fundamental requirements for the next generation of electronic packaging materials. Currently, metal matrix composites (MMCs) composed of high TC matrix metals and reinforcing phase materials have become the mainstream direction for the development and application of high-performance packaging materials. Silicon carbide (SiC) is the optimal choice for the reinforcing phase due to its high TC, low CTE, and high hardness. This paper reviews the research status of SiC-reinforced aluminum (Al) and copper (Cu) electronic packaging materials, along with the factors influencing their thermo-mechanical properties and improvement measures. Finally, the current research status and limitations of conventional manufacturing methods for SiC-reinforced MMCs are summarized, and an outlook on the future development trends of electronic packaging materials is provided.

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Section: Current Status Of Metal-based Electronic Packaging Materialsmentioning

confidence: 99%

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

Lai

Niu

et al. 2023

Micromachines

View full text Add to dashboard Cite

show abstract

Effect of Solid Solution System on the Properties of Al-6.5Si-5.5Cu-0.2Zr-0.01Sr-0.06Ti-0.2Ce Alloy in the Aging State

Yan

Zhou

et al. 2023

J. of Materi Eng and Perform

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Effect of Multistage Solid Solution Treatment on Microstructure and Properties of Al-6.5Si-5.5Cu-0.2Zr-0.01Sr-0.06Ti-0.2Y Alloy

Li,

Xu,

Zhou

et al. 2024

J. of Materi Eng and Perform

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Effect of SiCw volume fraction and cold pressure on microstructure and mechanical properties of aluminum matrix composites

Cited by 6 publications

References 22 publications

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

Effect of Solid Solution System on the Properties of Al-6.5Si-5.5Cu-0.2Zr-0.01Sr-0.06Ti-0.2Ce Alloy in the Aging State

Effect of Multistage Solid Solution Treatment on Microstructure and Properties of Al-6.5Si-5.5Cu-0.2Zr-0.01Sr-0.06Ti-0.2Y Alloy

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