Effect of relative tool sharpness on subsurface damage and material recovery in nanometric cutting of mono-crystalline silicon: A molecular dynamics approach

Kalkhoran, Seyed Nader Ameli; Vahdati, Mehrdad; Yan, Jiwang

doi:10.1016/j.mssp.2019.104868

Cited by 22 publications

(12 citation statements)

References 54 publications

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“…In ordinary cutting, the dominant material removal mechanism can be greatly influenced by the undeformed chip thickness [54]. With small undeformed chip thickness, the dominant material removal mechanism is extrusion.…”

Section: Cutting Performancementioning

confidence: 99%

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Liu

Chu

et al. 2021

Nanoscale Res Lett

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In this paper, molecular dynamics simulations are carried out to investigate the cutting mechanism during the hybrid machining process combined the thermal and vibration assistants. A modified cutting model is applied to study the material removal behavior and subsurface damage formation in one vibration cycle. The results indicate that during the hybrid machining process, the dominant material removal mechanism could transform from extrusion to shearing in a single vibration cycle. With an increase of the cutting temperature, the generation and propagation of cracks are effectively suppressed while the swelling appears when the dominant material removal mechanism becomes shearing. The formation mechanism of the subsurface damage in one vibration cycle can be distinct according to the stress distribution. Moreover, the generation of the vacancies in workpiece becomes apparent with increasing temperature, which is an important phenomenon in hybrid machining process.

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Section: Cutting Performancementioning

confidence: 99%

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Liu

Chu

et al. 2021

Nanoscale Res Lett

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“…To better observe the simulation results, the length of the workpiece in the cutting direction is slightly larger than the width of the workpiece. Moreover, the width of the tool is 2 nm, which is smaller than the width of the workpiece, different from other studies, 42 This can help to observe the side flow phenomenon of the chip after the tool cutting. The tool radius is 2 nm.…”

Section: Simulation Methodsmentioning

confidence: 79%

Atomistic study of nano-cutting bicrystal cubic silicon carbide

Dai

2022

Proceedings of the Institution of Mechanical Engineers, Part C:

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To solve problems of low machining efficiency and surface/subsurface damage of silicon carbide (SiC), mechanisms of material dislodging and subsurface destruction of bicrystal SiC under nano-cutting were studied by using three-dimensional molecular dynamics (MD) simulation method. Effects of grain boundary (GB) tilt angle and cutting speed on stress, hydrostatic pressure, cutting force, temperature, and subsurface damage depth were analyzed. Results show that GB slope angle has important influence on the spread of strain, hydrostatic stress, and temperature, especially on subsurface damage depth. Specifically, with the increase in GB slope angle, subsurface damage layer decreases, and machined surface morphology improves. The machinability of small GB angle is better than the large GB angle, and the model with grain boundary angle of 4.24° has the best machinability. It is also found that with the increase in cutting velocity, the temperature increases, whereas cutting force and friction coefficient are reduced, which indicates that the increase in cutting velocity can effectively improve surface machined morphology. The research results provide a theoretical reference for future experimental research.

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“…While e cient procedures to study the intermediate events during fast friction induced transformations of the surface of metals are emerging [12][13][14] , current setups to study machining represent a platform to learn about conditions and structures of these nano-structured materials, which are e ciently preserved by the ultra-fast cooling happening in chips after cutting 8 . Properties of bulk nanostructures metals are well known and characterized by an increase of the strength and a detrimental thermal stability, common for both bottom-up and top-down fabrication methods 15 .…”

Section: (Ecae)mentioning

confidence: 99%

Mechanical properties of friction induced nanocrystalline pearlitic steel

Medina-Clavijo

Rafael-Velayarce

Saez-de-Buruaga

et al. 2022

Preprint

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Nanocrystalline variants of commercially available alloys have shown the potential of boosting the mechanical properties retaining a feasible supply chain. One approach to achieve these nanostructures reside in frictional treatments on parts, leading to differential refinement in surface and bulk. In this work the machining method is considered as a testing platform to study frictional nanostructured steel, which assembly is stabilized by fast cooling at the chip. The analysis of the mechanical properties has shown extraordinary results at the surface, over 2000 MPa of strength on AISI1045 steel, more than three times the strength of the base material, demonstrating at the same time a reduction of 15% in the elastic modulus. The microscopic analysis suggests a reassembly of the elements in a new lattice of carbon supersaturated nano-ferrite.

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Effect of relative tool sharpness on subsurface damage and material recovery in nanometric cutting of mono-crystalline silicon: A molecular dynamics approach

Cited by 22 publications

References 54 publications

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Atomistic study of nano-cutting bicrystal cubic silicon carbide

Mechanical properties of friction induced nanocrystalline pearlitic steel

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