Effect of polyimide thickness on its adhesion to silicon nitride substrate with and without adhesion promoter

The Potential Barrier and Thermal Stability Dependence on PI Thickness of Al/PI/c-Si Schottky Diode

“…From this figure, it can be observed that the non-linearity of the I-V characteristic curve indicates that the non-ohmic conduction mechanism in nature is caused by thermionic and diffusion mechanisms [9]. The good rectifying nature of the device refers to the presence of barriers on its two sides.…”

Edge delamination of residually stressed thin films: viscoelastic effects

“…In the presence of water, adhesion of polyimide to substrates such as glass and aluminum falls off rapidly [16][17]. The accurate measurement of Gc as a function of moisture content has not been clearly documented in the literature, so we are forced to conjecture as to the nature of the behavior.…”

Photoluminescence, thermal and surface properties of triarylimidazole-containing polyimide nanocomposite films

“…[9][10][11] The PI lm with high temperature resistance, colorless and transparent characteristics can be used as coating, protective layer, exible displays and transparent circuit boards, etc. [12][13][14][15][16] Moreover, there has been a growing interest in functional PI lm materials. [17][18][19][20] For instance, photoluminescence PI has attracted researchers' interest because of its unique luminescence properties.…”