Effect of phosphorus element on the comprehensive properties of Sn–Cu lead-free solder

Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In

“…In addition, the solderability of Sn-0.7Cu solder was poorer than that of Sn-Pb, Sn-Ag and Sn-Ag-Cu eutectic solders [11]. Also, the tensile and shear strength of Sn-Cu eutectic solder were found to be inferior to those of Sn-Ag and Sn-Ag-Cu eutectic solders.…”

Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In

“…It is environmentally benign, inexpensive and has good electrical conductivity. Sn-0.7Cu solder has a melting point equal to 227 • C. Meanwhile, the primary interest is the lower cost compared with the other candidate lead-free solder alloys [2,3]. The presence of Cu in Sn-based materials leads to an improvement in resistance to thermal cycle fatigue and wetting properties due to the formation of Cu 3 Sn and Cu 6 Sn 5 IMCs.…”

“…Great achievement has been focused on developing the overall wetting and soldering properties of Sn-Cu solder and progress has been made by adding different alloying elements, such as Ag, In, Zn, and Ni [3,[8][9][10]. The presence of the second phase has been shown to trigger the microstructural mechanism that enhances the reliability of the solder joints.…”

“…Nonetheless, the improvement of mechanical properties is closely related to the amount and type of alloying elements and so, some alloying additions may not improve the properties to a desirable extent and sometimes even deteriorate them [2,10,11]. For example, Li et al [3] found that the addition of trace P element into Sn-Cu eutectic solder led to the increase in the rate of forming void of Sn-0.7Cu solder joint. As a result, the creep fatigue of solder joint containing P such as Sn-0.7Cu-0.005P offered worse property compared to Sn-0.7Cu solder joint.…”

Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder

“…Therefore, it will not only produce a lot of wastes, but also increase the defects probability of solder joint for wave soldering applications which would seriously affect the reliability of soldering joints 3) . Thus, it is expected to improve its wettability and oxidation resistance performance by adding trace amount of elements such as; P 4,5) , Ag 3,6) , and Al 7) . However, these studies generally are centered on low temperature around 260 C. Electronics manufacturers sometimes need to use the same solder in a wider temperature range in the actual production process, such as 250 C 400 C. So the research on wettability and oxidation resistance of solder at high temperature is particularly important.…”