Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In

El-Daly, A.A.; Hammad, A.E.

doi:10.1016/j.jallcom.2011.05.119

Cited by 83 publications

(39 citation statements)

References 35 publications

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“…Furthermore, the ternary Sn-Bi-Cu ternary alloys may also be considered as promising lead-free solders 19 . Recently, Ag, Bi or In-containing Sn-Cu alloys have received some attention, and in several prominent reliability test programs Sn-Cu-Ag and Sn-Cu-In alloys demonstrated superior performance, at least in its mechanical strength 20,21 . Tai et al 22 showed that creep resistance of Sn-3.5Ag was improved significantly for Cu particle-reinforced composite solder joints at 25 o C, 65 o C and 105 o C. The tensile strength increased with increasing Bi content in the Sn-Cu eutectic solder alloy, which was attributed to the presence of Bi and its role in refining microstructure and solid solution strengthening 23 .…”

Section: Introductionmentioning

confidence: 99%

Microstructural evolution and mechanical properties of Sn-Bi-Cu ternary eutectic alloy produced by directional solidification

2018

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Sn-36Bi-22Cu (wt.%) ternary eutectic alloy was prepared using vacuum melting furnace and casting furnace. The samples were directionally solidified upwards solidification rate varying from 8.3 to 166 µm/s and at a constant temperature gradient (4.2 K/mm) in a Bridgman-type directional solidification furnace. The composition analysis of the phases and the intermetallics (Cu 3 Sn and Cu 6 Sn 5 ) were determined from EDX and XRD analysis respectively. The variation of the lamellar spacing (Bi-rich phase) and the Cu 3 Sn phase spacing with the solidification rate were investigated. The dependence of microhardness, ultimate compressive strength and compressive yield strength on solidification rate were determined. The spacing and microhardness were measured from both longitudinal and transverse sections of the samples. The dependence of microhardness on the lamellar spacing and the Cu 3 Sn phase spacing were also determined. The relationships between phase spacings, solidification rate and mechanical properties were determined from linear regression analysis.

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Section: Introductionmentioning

confidence: 99%

Microstructural evolution and mechanical properties of Sn-Bi-Cu ternary eutectic alloy produced by directional solidification

2018

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“…This is possibly the reason why on increasing the wt.% of Ag above 2.5 wt.% in the eutectic composition of Sn-0.7Cu, the hardness of the alloy decreases. The microstructural changes cause the decrease of hardness of the solder alloy [1,19].…”

Section: Resultsmentioning

confidence: 99%

“…Elements that can be used in lead free soldering are Cu, Ag, Zn, Bi, Sb, Ni, In, Ge, Al and Cr in a combination with Sn, by making a binary, ternary or quaternary system. Both Sn-Cu and Sn-Zn alloys are * E-mail: nasimulalam@yahoo.com considered as potential candidates for lead free solders [1][2][3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Effect of Ag on Sn–Cu and Sn–Zn lead free solders

Alam

Mishra

Kumar

2015

Materials Science-Poland

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Lead and lead-containing compounds are considered as toxic substances due to their detrimental effect on the environment. Sn-based soldering systems, like Sn-Cu and Sn-Zn are considered as the most promising candidates to replace the eutectic Sn-Pb solder compared to other solders because of their low melting temperature and favorable properties. Eutectic Sn-0.7 wt.% Cu and near eutectic composition Sn-8 wt.% Zn solders have been considered here for study. For the Sn-Cu system, besides the eutectic Sn-0.7 wt.% Cu composition, Sn-1Cu and Sn-2Cu were studied. Three compositions containing Ag: Sn-2Ag-0.7Cu, Sn-2.5Ag-0.7Cu and Sn-4.5Ag-0.7Cu were also developed. Ag was added to the eutectic Sn-0.7 wt.% Cu composition in order to reduce the melting temperature of the eutectic alloy and to enhance the mechanical properties. For the Sn-Zn system, besides the Sn-8 wt.% Zn near eutectic composition, Sn-8Zn-0.05Ag, Sn-8Zn-0.1Ag and Sn-8Zn-0.2Ag solder alloys were developed. The structure and morphology of the solder alloys were analyzed using a scanning electron microscope (SEM), filed emission scanning electron microscope (FESEM), electron diffraction X-ray spectroscopy (EDX) and X-ray diffraction (XRD). Thermal analysis of the alloys was also done using a differential scanning calorimeter (DSC). Trace additions of Ag have been found to significantly reduce the melting temperature of the Sn-0.7 wt.% Cu and Sn-8 wt.% Zn alloys.

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“…In the studies of El-Daly and Hammad [113,120] Increasing amount of SiC reinforcement also resulted in an increase of the microhardness value of the reinforced solder. The findings of Wang et al [114], on studying the influence of SiC reinforcements to Sn-3.7Ag-0.9Zn where β-Sn dendrites, Ag3Sn and AgZn intermetallics were able to be refined, can be observed in Figure 21.…”

Section: Mechanical Properties Of Reinforced Soldermentioning

confidence: 95%

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

Salleh¹,

Anuar²

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Electronics manufacturers are pushing the limits in reducing the physical size of circuitry while simultaneously increasing the number of transistors to satisfy Moore's Law [1]. This includes investing in new materials, and configuring new ways to manufacture complex 3D (three dimensional) electronic packaging [1]. One key requirement of new materials and techniques is ensuring the high reliability of the resultant products in various challenging operating environments including thermal and mechanical extremes [2][3][4]. A viable method to enhance the properties and performance of a solder joint is by incorporation of reinforcement particles to the solder matrix, either by intrinsic or extrinsic methods. In this thesis a series of Sn-Cu Pb-free solder alloys with extrinsic or intrinsic phase reinforcement were manufactured and the microstructure and soldering behavior were investigated in detail.Additions of extrinsic reinforcement in the form of nano-sized ceramic material were made using a microwave sintering powder metallurgy (PM) method, which is a viable method to improve the mechanical and thermal properties of Pb-free solder materials. In addition, the advanced processing routes ensures a homogenous distributions of reinforcement particles is present. To investigate the performance of the reinforced bulk solders including thermal and mechanical properties and relate this to the microstructure, samples were investigated using techniques such as synchrotron micro-XRF, HRTEM, SEM, XPS, dilatometery, DSC and shear and microhardness testing. A hypothesis of how reinforcement improves solder properties is developed and discussed. Synchrotron X-ray radiography imaging (SXRI) was used to analyse the development of microstructure and the complex interactions occurring in the solders. Based on the properties of the fabricated solder, the microwave sintering PM route was discussed as a promising method for the reinforcement of Pb-free solders.The initial formation of interfacial IMC products was studied in Sn-Cu based solder alloys by in situ experiment techniques such as SXRI and UHV-TEM. The results provide direct experimental evidence of real-time initial Cu6Sn5 layer development during soldering and also the stress creation and release events that arise due to the polymorphic transformations of the Cu6Sn5 phase and the associated volumetric change.ii In addition, the nucleation and growth behavior of primary intermetallics which can be considered an intrinsic reinforcing material in solder joints was studied. Here, the nucleation and growth behavior of primary Cu6Sn5 and β-Sn crystals in some of the most commonly used solder alloys including Sn-0.7Cu and Sn-3.0Ag-0.5Cu is explained. This also includes the effects of Ni additions for refining primary Cu6Sn5 in Sn-Cu solder joints. Using SXRI, observations were made during solder joint solidification, which is difficult using conventional methods. The initial nucleation and solidification kinetics of primary Cu6Sn5 crystals were discussed.The growth of pri...

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Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In

Cited by 83 publications

References 35 publications

Microstructural evolution and mechanical properties of Sn-Bi-Cu ternary eutectic alloy produced by directional solidification

Microstructural evolution and mechanical properties of Sn-Bi-Cu ternary eutectic alloy produced by directional solidification

Effect of Ag on Sn–Cu and Sn–Zn lead free solders

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

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