1998
DOI: 10.1109/23.736490
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Effect of ion energy upon dielectric breakdown of the capacitor response in vertical power MOSFETs

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Cited by 67 publications
(19 citation statements)
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“…Past studies have suggested that the ion atomic number may play a role in SEGR susceptibility, beyond simply the ion LET or total charge ionization [3,8]. To our knowledge, this study is the first to control for the charge ionization in the silicon epilayer in order to examine the impact on SEGR of different ion species.…”
Section: Discussionmentioning
confidence: 99%
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“…Past studies have suggested that the ion atomic number may play a role in SEGR susceptibility, beyond simply the ion LET or total charge ionization [3,8]. To our knowledge, this study is the first to control for the charge ionization in the silicon epilayer in order to examine the impact on SEGR of different ion species.…”
Section: Discussionmentioning
confidence: 99%
“…To better understand these data, we also validated the Titus-Wheatley formula [3], V s crit = (10 7 )(t ox )/(1+ Z/44), finding the critical Vgs for SEGR with Vds fixed at 0 V (Fig. 6).…”
Section: Resultsmentioning
confidence: 99%
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“…It has been recently shown that ionizing radiation can produce leakage currents across thin gate oxides with electrical characteristics similar to those found after electrical stresses [3]- [8]. The first observations concerned the catastrophic single-event gate rupture (SEGR), already observed on relatively thick oxides irradiated under high oxide fields [9]- [11]. Then, the radiation-induced leakage current (RILC) was reported for oxides in the range 4-8 nm [3], [4], [12], [13].…”
Section: Introductionmentioning
confidence: 97%
“…For metal oxide semiconductors and complementary metal oxide semiconductors (CMOS), the insulating SiO 2 thin layer is used as the gate dielectric, which CONTACT Q. Yang qyang@xtu.edu.cn is vital for surface electrical field control and device isolation. The radiation of high-energy ions can induce charge lose and electrical properties degradation in CMOS by charge injection into the gate dielectric (9)(10)(11)(12). For example, the SHI can produce micro-damage (harderror), which may lead to the data losing in dynamic random access memory (13).…”
Section: Introductionmentioning
confidence: 99%