Effect of intermetallic compounds on vibration fatigue of μBGA solder joint

Effect of a trace of Cr on intermetallic compound layer for tin–zinc lead-free solder joint during aging

“…A too-thick IMC layer deteriorates the solder joint reliability because the IMC are brittle and have different densities from the solder alloys [27][28][29]. So, it is of important that addition of Cr is benefit for restraining interfacial intermetallic compound.…”

Intermetallic compound formation at Sn–3.0Ag–0.5Cu–1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions

“…However, during storage and field service, the growth of IMCs will influence the strength of solder joints and result in mechanical failure of the joints [8,9]. Therefore, the formation and growth of IMCs during soldering and long-term thermal aging has been widely studied during the past few decades.…”

Effect of phosphorus element on the comprehensive properties of Sn–Cu lead-free solder

“…It is reported that IML formed at the interface between solder and substrate has great effect on the reliability of solder joints [7][8][9][10][11][12][13]. With the thickness of IML increasing, shear strength and thermal fatigue lifetime will be degraded [14][15][16].…”