Intermetallic compound formation at Sn–3.0Ag–0.5Cu–1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions

Wang, Fengjiang; Yu, Zhishui; Qi, Kai

doi:10.1016/j.jallcom.2006.08.012

Cited by 66 publications

(34 citation statements)

References 15 publications

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“…43) Since these solders contained 89 mass% of Zn, Zn atoms diffused to the joint interfaces sufficiently during isothermal aging; consequently, the Cu 5 Zn 8 IMC layer grew and the total IMC layer became progressively thicker. 43) The interfacial structures of Sn3 mass%Ag0.5 mass%Cu1 mass%Zn after isothermal aging also were reported 44) and they are identical to those of Sn8Zn3Bi and Sn9Zn; however, the growth of the IMC layers was suppressed. The suppression mechanism could be considered to be as follows: small Zn content of the solder alloy leads to insufficient diffusion of Zn to the joint interface, resulting in suppression of the growth of Cu 5 Zn 8 layer during isothermal aging.…”

Section: Microstructural Evolution Of the Interface During Thermal Cymentioning

confidence: 70%

Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints during Thermal Cycling

et al. 2013

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The effects of adding small amounts of Zn on the microstructural evolution of low-Ag SnAgCu solders and thermal shock behavior during thermal cycling between ¹40 and 125°C were investigated. Observation of the visual appearance of the solder joints revealed that the probability of solder deformation and crack initiation in the solder fillets after thermal cycling was lower in Sn1Ag0.3Cu1Zn than in Sn 3Ag0.5Cu. Microstructural observation of the interface of the solder joints revealed that the addition of Zn to a low-Ag SnAgCu solder inhibited the growth of the intermetallic compound layer between the solder and the Cu pad in printed circuit boards. The addition of small amounts of Zn improved the thermal shock behavior of the low-Ag SnAgCu solder.

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Section: Microstructural Evolution Of the Interface During Thermal Cymentioning

confidence: 70%

Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints during Thermal Cycling

et al. 2013

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“…To address the health and environmental safety concerns associated with lead and lead-containing alloys, research has been conducted over the past decade to find suitable lead-free solder alloys to replace the eutectic Sn-37Pb solder that has typically been used for interconnection in electronic assembly [1][2][3][4]. Much of this research has focused on the development of lead-free, Sn-based, binary and ternary systems-including those associated with Sn-Bi, Sn-Zn, Sn-Zn-Bi, Sn-Ag, Sn-Ag-Zn, Sn-Zn-In, Sn-Bi-Ag, and Sn-Ag-Cu [5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates

Fouzder

Chan

Chan³

2014

J Mater Sci: Mater Electron

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Nano-sized, non-reacting, non-coarsening CeO 2 particles with a density close to that of solder alloy were incorporated into Sn-3.0 wt%Ag-0.5 wt%Cu solder paste. The interfacial microstructure and hardness of Ag surfacefinished Cu substrates were investigated, as a function of reaction time, at various temperatures. After the initial reaction, an island-shaped Cu 6 Sn 5 intermetallic compound (IMC) layer was clearly observed at the interfaces of the SnAg-Cu based solders/immersion Ag plated Cu substrates. However, after a prolonged reaction, a very thin, firmly adhering Cu 3 Sn IMC layer was observed between the Cu 6 Sn 5 IMC layer and the substrates. Rod-like Ag 3 Sn IMC particles were also clearly observed at the interfaces. At the interfaces of the Sn-Ag-Cu based solder-Ag/Ni metallized Cu substrates, a (Cu, Ni)-Sn IMC layer was found. Rod-like Ag 3 Sn and needle-shaped Cu 6 Sn 5 IMC particles were also observed on the top surface of the (Cu, Ni)-Sn IMC layer. As the temperature and reaction time increased, so did the thickness of the IMC layers. In the solder ball region of both systems, a fine microstructure of Ag 3 Sn, Cu 6 Sn 5 IMC particles appeared in the b-Sn matrix. However, the growth behavior of the IMC layers of composite solder doped with CeO 2 nanoparticles was inhibited, due to an accumulation of surface-active CeO 2 nanoparticles at the grain boundary or in the IMC layers. In addition, the composite solder joint doped with CeO 2 nanoparticles had a higher hardness value than the plain Sn-Ag-Cu solder joints, due to a well-controlled fine microstructure and uniformly distributed CeO 2 nanoparticles. After 5 min of reaction on immersion Agplated Cu substrates at 250°C, the micro-hardness values of the plain Sn-Ag-Cu solder joint and the composite solder joints containing 1 wt% of CeO 2 nanoparticles were approximately 16.6 and 18.6 Hv, respectively. However after 30 min of reaction, the hardness values were approximately 14.4 and 16.6 Hv, while the micro-hardness values of the plain Sn-Ag-Cu solder joints and the composite solder joints on Ag/Ni metallized Cu substrates after 5 min of reaction at 250°C were approximately 15.9 and 17.4 Hv, respectively. After 30 min of reaction, values of approximately 14.4 and 15.5 Hv were recorded.

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“…During solid state aging, the scallop like Cu 6 Sn 5 grains disappear, and the compound morphology changes into a layer-type due to the high interfacial energy between solid solder and scallop like Cu 6 Sn 5 . [60] Wang [5] showed by electron backscatter diffraction (EBSD) that although each Cu 6 Sn 5 grain had its own orientation, the Cu 6 Sn 5 grains merged into one single grain as they approached each other. According to Sunwoo et al [12] and Zeng et al [33] this behavior is driven by the surface tension and can occur relatively rapidly, particularly when assisted by surface diffusion at the interface.…”

Section: Microstructurementioning

confidence: 99%

“…In many cases, the two IMCs are not differentiated but the total IMC thickness is commonly reported as a single value. [21][22][23][24][25][26][27] This does not give a complete picture of the kinetics of the reactive diffusion processes between Cu and Sn. Structural and diffusion properties in the Cu-Sn system have been investigated since the 1960s by Starke et al [28] who determined the diffusion coefficients of Cu-Sn IMC phases.…”

Section: Introductionmentioning

confidence: 99%

Intermetallic Layer Growth Kinetics in Sn‐Ag‐Cu System using Diffusion Multiple and Reflow Techniques

2014

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A diffusion multiple (DM) technique was applied to the Sn-Ag-Cu ternary system with the aim to determine the kinetics of formation of Cu-Sn intermetallic compounds (IMCs) and to predict properties of the interface in the solder joints. The formation and growth of the Cu-Sn intermetallics at the interface between the Cu as a base material and Sn-Ag-(Cu) solder was additionally studied during a standard reflow soldering process. Based on the experimental data, the kinetic rate constants and the respective activation energies of the Cu-Sn IMCs in the temperature range between 150 and 200°C were calculated and compared with experimental data from the literature. In this way, the mechanism of the pure solid-state reaction (DM technique) and liquid phase reaction (reflow soldering) were studied. The limitations of DM techniques for the prediction of the IMCs growth during reflow soldering process are discussed as well.

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Intermetallic compound formation at Sn–3.0Ag–0.5Cu–1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions

Cited by 66 publications

References 15 publications

Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints during Thermal Cycling

Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints during Thermal Cycling

Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates

Intermetallic Layer Growth Kinetics in Sn‐Ag‐Cu System using Diffusion Multiple and Reflow Techniques

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Intermetallic compound formation at Sn–3.0Ag–0.5Cu–1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions

Cited by 66 publications

References 15 publications

Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn&ndash;Ag&ndash;Cu Solder Joints during Thermal Cycling

Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn&ndash;Ag&ndash;Cu Solder Joints during Thermal Cycling

Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates

Intermetallic Layer Growth Kinetics in Sn‐Ag‐Cu System using Diffusion Multiple and Reflow Techniques

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Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints during Thermal Cycling

Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints during Thermal Cycling