2002
DOI: 10.1116/1.1486232
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Effect of H2 on the etch profile of InP/InGaAsP alloys in Cl2/Ar/H2 inductively coupled plasma reactive ion etching chemistries for photonic device fabrication

Abstract: This study demonstrates etch profile engineering of InP, In1−xGaxAs1−yPy, and In0.53Ga0.47As heterostructures results from adding H2 to standard Cl2/Ar inductively coupled plasma-reactive ion etching chemistries. Etch rate curves of bulk InP, In1−xGaxAs1−yPy, and In0.53Ga0.47As show a general parabolic trend as a function of the H2 component of the Cl2/Ar/H2 ratio. Three distinct etching profiles of InP/InGaAsP layers were realized by varying the Cl2/Ar/H2 ratio. Highly anisotropic profiles result for Cl2/Ar/H… Show more

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Cited by 51 publications
(22 citation statements)
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“…A dry-etching process that can produce highly anisotropic profiles, smooth sidewalls, and a smooth etched surface is generally required to fabricate optical waveguides or cavities with minimal optical loss. Inductively coupled plasma (ICP) etching has been widely used in the past for fabricating such InP-based optical devices, and various chlorine- [1][2][3][4][5][6] and HBr-containing [7][8][9] chemistries have been proposed for anisotropic ICP etching of InP. However, the influence of the etched surface composition upon the passivation mechanism is often unknown.…”
Section: Introductionmentioning
confidence: 99%
“…A dry-etching process that can produce highly anisotropic profiles, smooth sidewalls, and a smooth etched surface is generally required to fabricate optical waveguides or cavities with minimal optical loss. Inductively coupled plasma (ICP) etching has been widely used in the past for fabricating such InP-based optical devices, and various chlorine- [1][2][3][4][5][6] and HBr-containing [7][8][9] chemistries have been proposed for anisotropic ICP etching of InP. However, the influence of the etched surface composition upon the passivation mechanism is often unknown.…”
Section: Introductionmentioning
confidence: 99%
“…12 Briefly, PMMA-P͑MMA-MAA͒ bilayer electron-beam resist system was used for the lift-off of NiCr metal mask, which was subsequently utilized for transferring patterns into a SiO 2 layer deposited on the waveguide heterostructures. The re-sulting NiCr/SiO 2 was used as a mask to etch waveguide heterostructures using a Cl 2 /Ar/H 2 gas mixture.…”
mentioning
confidence: 99%
“…There have been a few papers that investigated ICP etching of InGaAsP using Cl 2 :H 2 :Ar chemistry [6,7]. We have previously optimized the conditions of this etch to yield smooth and straight sidewalls for deeply etched waveguides, for which low passive loss was demonstrated [8].…”
Section: Fabrication Of Ebs In Ingaasp/inpmentioning
confidence: 99%