Effect of Finite Element Modeling Techniques on Solder Joint Fatigue Life Prediction of Flip-Chip BGA Packages

Fan, Xuejun; Pei, Min; Bhatti, Pardeep K.

doi:10.1109/ectc.2006.1645772

Cited by 30 publications

(12 citation statements)

References 16 publications

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“…tutive Equation for Sn4Ag0.5Cu. Fan et al [56] used the similar two-power creep equation (Table 5) to perform finite element analysis of a flip-chip BGA package on PCB as shown in Fig. 27.…”

Section: Example On Using the Wises Two-power Creep Consti-mentioning

confidence: 99%

“…A global/local modeling is also adopted in Ref. [56] and shown in the lower right-hand side of Fig. 27.…”

Section: Example On Using the Wises Two-power Creep Consti-mentioning

confidence: 99%

“…Wises, bulk (Sn3.5Ag) [59][60][61][62] Wises, bulk (Sn4Ag0.5Cu) [59][60][61][62] Fan, PCB (Sn4Ag0.5Cu) [56] E (GPa) 52.71-0.0677T (K) 62.24-0.075T (K) 59.53-0.0677T (K) where de/dt is the inelastic strain rate, A is the pre-exponential factor, Q is the activation energy, R is the universal gas constant (8.314 JÁK À1 Ámol À1 ), T is the absolute temperature (Kelvin), n is the multiplier of stress, r is the equivalent stress, m is strain rate sensitivity. The evolution equation which defines an internal variable s of the model and its saturation value is…”

Section: Examples On Using Garofalo Hyperbolic Sinementioning

confidence: 99%

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State of the Art of Lead-Free Solder Joint Reliability

Lau

2020

Journal of Electronic Packaging

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State-of-the-art of lead-free solder-joint reliability is investigated in this study. Emphasis is placed on the design for reliability (DFR) and reliability testing and data analysis. For DFR: (a) the Norton power creep constitutive equations and examples for Au20Sn, Sn58Bi, Sn3.8Ag0.7Cu, and Sn3.8Ag0.7Cu0.03Ce, (b) the Wises two power creep constitutive equations and examples for Sn3.5Ag and Sn4Ag0.5Cu, (c) the Garofalo hyperbolic sine creep constitutive equations and examples for Sn3.5Ag, Sn3Ag0.5Cu, Sn3.9Ag0.6Cu, Sn3.8Ag0.7Cu, Sn3.5Ag0.5Cu, and Sn3.5Ag0.75Cu, Sn4Ag0.5Cu, Sn(3.5-3.9)Ag(0.5-0.8)Cu, 100In, Sn52In, Sn3.8Ag0.7Cu0.03Ce, and Au20Sn, and (d) the Anand viscoplasticity constitutive equations and examples for Sn3.5Ag, Sn3Ag0.5Cu, Sn3.8Ag0.7Cu, Sn3.8Ag0.7CuCe, Sn3.8Ag0.7CuAl, Au20Sn, Sn3.5Ag with temperature and strain rate dependent parameters, and Sn1Ag0.5Cu, Sn2Ag0.5Cu, Sn3Ag0.5Cu, and Sn4Ag0.5Cu after extreme aging will be discussed. For reliability testing and data analysis: (a) the Weibull and lognormal life distributions for lead-free solder joints under thermal-cycling and drop tests, (b) the true Weibull slope, true characteristic life, and true mean life, and (c) the linear acceleration factors for various lead-free solder alloys based on: (i) frequency and maximum temperature, (ii) dwell time and maximum temperature, and (iii) frequency and mean temperature will be presented. Some recommendations will also be provided.

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Section: Example On Using the Wises Two-power Creep Consti-mentioning

confidence: 99%

“…A global/local modeling is also adopted in Ref. [56] and shown in the lower right-hand side of Fig. 27.…”

Section: Example On Using the Wises Two-power Creep Consti-mentioning

confidence: 99%

Section: Examples On Using Garofalo Hyperbolic Sinementioning

confidence: 99%

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State of the Art of Lead-Free Solder Joint Reliability

Lau

2020

Journal of Electronic Packaging

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“…The common failure modes of lead free solder joints in many microelectronics devices is creep fatigue [8,9] and the crack propagation time is often relatively small or even negligible compared to the total time to failure [8,[10][11][12]. The latter is due to the formation of an intermetallic compound (IMC) layer at the interface which is brittle and less ductile [13][14][15].…”

Section: Introductionmentioning

confidence: 98%

On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects

Zhang

Zwaag

Zeijl

et al. 2013

2013 IEEE 63rd Electronic Components and Technology Conference

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The reliability of solder interconnects in electronic packages is of vital importance. However, the demand for rapid product development puts an urgent need to develop new and fast testing methods and protocols for accurate crack initiation and propagation measurements for the new generation lead free solder. The failure is mainly due to two consecutive processes: viscoplastic deformation ultimately leading to crack initiation and crack propagation that leads to final catastrophic failure. This study shows the capability of high precision DC electrical resistance measurement to distinguish and in-situ monitor both mentioned processes occurred in individual solder joint. The experimental measurements are supported by both model calculations and additional experiments. The method developed offers potential to minimize testing time to considerable extent for new solder joints. A new test protocol for estimating the crack initiation time in a solder joint is proposed. The new test protocol is based on a widely used energy based solder joint fatigue model in which the conventional damage metric is replaced by electrical resistance increase rate.

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“…In addition, Lau et al [19] and Depriver et al [20] found that simulation input parameters significantly influence the simulation results, such as convective heat transfer coefficient and solder joint material. Fan et al [21] compared average peel stress with cumulated equivalent creep strain in the solder joint, a supplement to the von mises stress in previous studies. Furthermore, Ye et al [10] proposed the surface marker movement technique to track electro-migration.…”

Section: Introductionmentioning

confidence: 99%

Multi-Physics Fields Simulations and Optimization of Solder Joints in Advanced Electronic Packaging

Gao

2022

Chips

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The endurability of solder joints in the ball-grid array (BGA) packaging is crucial to the functioning of the microelectronic system. To improve electronic packaging reliability, this paper is dedicated to numerically optimize solder joint array configuration and study the influence of multi-physical fields on solder joint reliability. The uniqueness of this study is that on the basis of temperature field and stress field, the electric field is added to realize the coupling simulation of three physical fields. In addition, the “Open Angle” is mathematically defined to describe the array configuration, and it was used to reveal the influence factors of solder joint fatigue, including stress, temperature, and current density. In the single solder joint model, the impacts of geometric shape and working conditions on the maximum value and distribution of these evaluation factors (stress, temperature, and current density) were investigated. Overall, the numerical investigation gives the optimal configuration, geometric shape, and working condition of solder joints, which benefits the design of endurable and efficient BGA packaging.

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Effect of Finite Element Modeling Techniques on Solder Joint Fatigue Life Prediction of Flip-Chip BGA Packages

Cited by 30 publications

References 16 publications

State of the Art of Lead-Free Solder Joint Reliability

State of the Art of Lead-Free Solder Joint Reliability

On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects

Multi-Physics Fields Simulations and Optimization of Solder Joints in Advanced Electronic Packaging

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