Effect of fabrication parameters on the thermophysical properties of sintered wicks for heat pipe applications

Espinosa, F.A. Dominguez; Peters, Teresa B.; Brisson, J. G.

doi:10.1016/j.ijheatmasstransfer.2012.07.037

Cited by 57 publications

(22 citation statements)

References 22 publications

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“…In comparison, a maximum capillary pressure of 65 kPa was measured for the fine copper sinter wick [15]. Therefore, the criteria in (10) are met for all of the geometries investigated.…”

Section: Evaporator and Condenser Designsmentioning

confidence: 96%

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Design of an Integrated Loop Heat Pipe Air-Cooled Heat Exchanger for High Performance Electronics

Peters

McCarthy

Allison

et al. 2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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The continually increasing heat generation rates in high performance electronics, radar systems and data centers require development of efficient heat exchangers that can transfer large heat loads. In this paper, we present the design of a new high-performance heat exchanger capable of transferring 1000 W while consuming less than 33 W of input electrical power and having an overall thermal resistance of 0.05 K/W. The low thermal resistance is achieved by using a loop heat pipe with a single evaporator and multiple condenser plates that constitute the array of fins. Impellers between the fins are driven by a custom permanent magnet synchronous motor in a compact volume of 0.1 × 0.1 × 0.1 m to maximize the heat transfer area and reduce the required airflow rate and electrical power. The design of the heat exchanger is developed using analytical and numerical methods to determine the important parameters of each component. The results form the basis for the fabrication and experimental characterization that is currently under development.Index Terms-Air cooling, heat exchanger, loop heat pipe, thermal management.

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“…In comparison, a maximum capillary pressure of 65 kPa was measured for the fine copper sinter wick [15]. Therefore, the criteria in (10) are met for all of the geometries investigated.…”

Section: Evaporator and Condenser Designsmentioning

confidence: 96%

“…The thermophysical properties of the sintered metal wicks were predicted based on the experiments and model presented in [15]. Fine (10 μm) copper wick provides a high thermal conductivity [100 W/(m · K)], but with low permeability (10 −13 m 2 ).…”

Section: Evaporator and Condenser Designsmentioning

confidence: 99%

Design of an Integrated Loop Heat Pipe Air-Cooled Heat Exchanger for High Performance Electronics

Peters

McCarthy

Allison

et al. 2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…Note: Most of the measurements were taken by Dom ınguez Espinosa through collaboration [25], and the sintering procedure and measurement method for each of the properties are detailed in Refs. [22,25].…”

Section: 4mentioning

confidence: 99%

Development and Characterization of an Air-Cooled Loop Heat Pipe With a Wick in the Condenser

Kariya¹,

Peters²,

Cleary³

et al. 2013

Journal of Thermal Science and Engineering Applications

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Thermal management of modern electronics is rapidly becoming a critical bottleneck of their computational performance. Air-cooled heat sinks offer ease and flexibility in installation and are currently the most widely used solution for cooling electronics. We report the characterization of a novel loop heat pipe (LHP) with a wick in the condenser, developed for the integration into an air-cooled heat sink. The evaporator and condenser are planar (102 mm Â 102 mm footprint) and allow for potential integration of multiple, stacked condensers. The condenser wick is used to separate the liquid and vapor phases during condensation by capillary menisci and enables the use of multiple condensers with equal condensation behavior and performance. In this paper, the thermal-fluidic cycle is outlined, and the requirements to generate capillary pressure in the condenser are discussed. The LHP design to fulfill the requirements is then described, and the experimental characterization of a single-condenser version of the LHP is reported. The thermal performance was dependent on the fan speed and the volume of the working fluid; a thermal resistance of 0.177 C/W was demonstrated at a heat load of 200 W, fan speed of 5000 rpm and fluid volume of 67 mL. When the LHP was filled with the working fluid to the proper volume, capillary pressure in the condenser was confirmed for all heat loads tested, with a maximum of 3.5 kPa at 200 W. When overfilled with the working fluid, the condenser was flooded with liquid, preventing the formation of capillary pressure and significantly increasing the LHP thermal resistance. This study provides the detailed thermal-fluidic considerations needed to generate capillary pressure in the condenser for controlling the condensation behavior and serves as the basis of developing multiplecondenser LHPs with low thermal resistance.

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“…The evaporator is housed in a machined Monel case with a solid copper base. The thermophysical properties of these three sinter types were characterized by Dominguez [1] and are given in Table 1. A sintered wick is also employed in the condensers of the device, featuring the same Monel sinter as the evaporator.…”

Section: Figure 2: the Evaporator And A Condenser In Phump Includingmentioning

confidence: 99%

Development of a Compensation Chamber for Use in a Multiple Condenser Loop Heat Pipe

Roche

Cleary

Peters

et al. 2013

Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer In

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We report the design and analysis of a novel compensation chamber for use in PHUMP, a multiple condenser loop heat pipe (LHP) capable of dissipating 1000 W. The LHP is designed for integration into a high performance air-cooled heat sink to address thermal management challenges in advanced electronic systems. The compensation chamber is integrated into the evaporator of the device and provides a region for volumetric expansion of the working fluid over a range of operating temperatures. Additionally, the compensation chamber serves to set the liquid side pressure of the device, preventing both flooding of the condensers and dry out of the evaporator. The compensation chamber design was achieved through a combination of computational simulation using COMSOL Multiphysics and models developed based on experimental work of previous designs. The compensation chamber was fabricated as part of the evaporator using Copper and Monel sintered wicks with various particle sizes to achieve the desired operating characteristics. Currently, the compensation chamber is being incorporated into a multiple condenser LHP for a high performance air-cooled heat sink.

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Effect of fabrication parameters on the thermophysical properties of sintered wicks for heat pipe applications

Cited by 57 publications

References 22 publications

Design of an Integrated Loop Heat Pipe Air-Cooled Heat Exchanger for High Performance Electronics

Design of an Integrated Loop Heat Pipe Air-Cooled Heat Exchanger for High Performance Electronics

Development and Characterization of an Air-Cooled Loop Heat Pipe With a Wick in the Condenser

Development of a Compensation Chamber for Use in a Multiple Condenser Loop Heat Pipe

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