2012
DOI: 10.1016/j.mssp.2011.08.005
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Effect of extended phosphorus diffusion gettering on chromium impurity in HEM multicrystalline silicon

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Cited by 10 publications
(5 citation statements)
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“…Like Fe, 21 experimentally observed gettering behaviors of Cr, 27 and Co 28 show a very rapid drop of gettered metal concentration as phosphorus concentration decreases, suggesting a strongly super-linear relationship between phosphorus and gettered metal concentrations. Ref.…”
Section: Continuum Models For P Deactivation and Fe Getteringmentioning
confidence: 91%
“…Like Fe, 21 experimentally observed gettering behaviors of Cr, 27 and Co 28 show a very rapid drop of gettered metal concentration as phosphorus concentration decreases, suggesting a strongly super-linear relationship between phosphorus and gettered metal concentrations. Ref.…”
Section: Continuum Models For P Deactivation and Fe Getteringmentioning
confidence: 91%
“…It is plausible that chromium point defects are largely responsible for the initially low lifetime and dramatic lifetime improvement. Chromium is known to be recombination-active in n-type silicon [4] and has sufficient diffusivity and solubility to be gettered [37]. We acknowledge the possibility that small copper-, nickel-, and/or iron-silicide precipitates may also contribute, because despite low recombination activity of isolated point defects in n-type silicon, these species readily form recombination-active precipitates [39] but respond well to extended gettering [40][41][42].…”
Section: Impurity Concentrations Are At or Below The Detection Limit mentioning
confidence: 96%
“…The EXT process consists of the same plateau at 845°C followed by a 2 hr anneal at 650°C before unloading. The EXT process was inspired by experience with the successful extraction of interstitial iron from p-type materials [35,36], but tuned for the extraction of chromium following the guidance of reference [37]. Iron point defects are not expected to significantly reduce lifetime in n-type silicon, while chromium point defects are expected to remain recombination active in n-type silicon, because of the ratio of hole and electron capture cross sections [4].…”
Section: Passivation Involved Formation Of a 20 Nm Layer Of Al 2 O 3 mentioning
confidence: 99%
“…because it strongly reduces the carrier lifetime of crystalline silicon wafer at a relatively high concentration of about 5 × 10 14 cm −3 , as measured by SIMS in an earlier study [9].…”
Section: Introductionmentioning
confidence: 60%