Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys

Hu, Xiaowu; Qiu, Yu; Jiang, Xiongxin; Li, Yulong

doi:10.1007/s10854-018-9684-x

Cited by 20 publications

(5 citation statements)

References 53 publications

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“…This explains the relatively higher hardness values observed at the CS-4 region for both alloys. The distribution of the integrated TiO2 nanoparticles in SAC305-1.0T also supports the dispersion strengthening mechanism [28]. As depicted from this study, the higher hardness values of the SAC305-1.0T were caused by the presence of TiO2 nanoparticles, which had basically prevented the dislocation slipping and deformation along the grain boundaries [29].…”

Section: Nanoindentation For Hardness Evaluationssupporting

confidence: 73%

Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder

Nasir

Yahaya

Erer

et al. 2019

Ceramics International

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The improvement in the hardness of Sn-3.0Ag-0.5Cu solder alloy reinforced with 1.0 wt. % TiO2 nanoparticles was evaluated by nanoindentation. A specific indentation array was performed on four different horizontal cross sections of the composite solder with different heights and diameters, in order to verify the mixing homogeneity of TiO2 nanoparticles within the Sn-3.0Ag-0.5Cu solder paste during the ball milling process. The phase analysis indicated successful blending of the Sn-3.0Ag-0.5Cu with the TiO2 nanoparticles. According the scanning electron microscopy micrographs, presence of the TiO2 nanoparticles reduced the size of the Cu6Sn5 and Ag3Sn intermetallic compound phases. Incorporation of the 1.0 wt. % TiO2 nanoparticles improved the hardness values up to 26.2 % than that of pure SAC305. The hardness values increased gradually from the top cross sections towards adjacent to the solder/substrate interface. The mechanism of the hardness improvement attained by the TiO2 nanoparticles addition were also investigated on the horizontal cross sections of the samples.

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Section: Nanoindentation For Hardness Evaluationssupporting

confidence: 73%

Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder

Nasir

Yahaya

Erer

et al. 2019

Ceramics International

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“…As the quantity of Cu added increased, the average grain size decreased, which was attributed to the pinning effect of the second phase. The thinnest Cu 6 Sn 5 IMC is diffused in the solder matrix, promoting precipitation hardening and enhancing the elongation resistance of the solder alloy (Hu et al , 2018).…”

Section: Mechanical Propertiesmentioning

confidence: 99%

A review: effect of copper percentage solder alloy after laser soldering

Abdullah

Idris

2022

SSMT

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Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering. Design/methodology/approach This study reviews the interfacial reactions at the solder joint interface, solder joint morphology and the theory on characterizing the formation and growth of IMCs. In addition, the effects of alloying and strengthening mechanism, including wettability, melting and mechanical properties are discussed. Findings This paper presents a comprehensive overview of the composition of tin-copper (Sn-Cu) solders with a potential to enhance their microstructure, mechanical characteristics and wettability by varying the Cu percentage. The study found that the best Cu content in the Sn-xCu solder alloy was 0.6–0.7 Wt.%; this composition provided high shear strength, vibration fracture life value and ideal IMC thickness. A method of solder alloy preparation was also found through powder metallurgy and laser soldering to improve the solder joint reliability. Research limitations/implications This study focuses on interfacial reactions at the solder joint interface, solder joint morphology, modelling simulation of joint strength and the theory on characterising the formation and growth of IMC. Originality/value The paper comprehensively summarises the useful findings of the Sn-Cu series. This information will be important for future trends in laser soldering on solder joint formation.

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“…Before the XRD analysis, samples were cut into solder spreading area on Cu substrate after being reflowed and onethird of the top surface was ground by sandpaper to obtain a flat and homogeneous surface for better accuracy [Figure 5(a)]. Typical IMC phases for SAC305/Cu samples were well matched with ICSD files (Hu et al, 2018;Li et al, 2017), for example, b -Sn (ICSD 98-009-1748), Cu 6 Sn 5 (ICSD 98-010-9332) and Ag 3 Sn (ICSD 98-000-1559).…”

Section: Structural Characterization Of Intermetallic Compoundsmentioning

confidence: 99%

Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints

Said

Nazeri

Sharif

et al. 2021

SSMT

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Purpose This paper aims to investigate the morphology and tensile properties of SAC305 solder alloy under the influence of microwave hybrid heating (MHH) for soldering at different microwave parameters. Design/methodology/approach Si wafer was used as susceptor in MHH for solder reflow. Microwave operating power for medium and high ranging from 40 to 140 s reflow time was used to investigate their effect on the microstructure and strength of SAC305/Cu solder joints. The morphology and elemental composition of the intermetallic compound (IMC) joint were evaluated on the top surface and cross-sectional view. Findings IMC formation transformed from scallop-like to elongated scallop-like structure for medium operating power and scallop-like to planar-like structure for high operating power when exposed to longer reflow time. Compositional and phase analysis confirmed that the observed IMCs consist of Cu6Sn5, Cu3Sn and Ag3Sn. A thinner IMC layer was formed at medium operating power, 80 s (2.4 µm), and high operating power, 40 s (2.5 µm). The ultimate tensile strength at high operating power, 40 s (45.5 MPa), was 44.9% greater than that at medium operating power, 80 s (31.4 MPa). Originality/value Microwave parameters with the influence of Si wafer in MHH in soldering have been developed and optimized. A microwave temperature profile was established to select the appropriate parameter for solder reflow. For this MHH soldering method, the higher operating power and shorter reflow time are preferable.

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Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys

Cited by 20 publications

References 53 publications

Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder

Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder

A review: effect of copper percentage solder alloy after laser soldering

Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints

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