Effect of Cu–Sn intermetallic compound reactions on the Kirkendall void growth characteristics in Cu/Sn/Cu microbumps

Park, Jong-Myeong; Kim, Seung Hyun; Jeong, Myung-Yung; Park, Young-Bae

doi:10.7567/jjap.53.05ha06

Cited by 44 publications

(18 citation statements)

References 23 publications

(33 reference statements)

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“…Therefore, the localized shear occurring along the solder close to the IMC interface results in the fracture which agreed well with the previous reports [22,34]. Figure 10a and b) upon aging also degrades the fracture toughness of the IMC layer [39]. Clearly most of the locations in the fractured IMC region displayed a broken grain with a brittle cleavage plane.…”

Section: Effect Of Zro2 Nanoparticle Size On the Shear Strength And Fsupporting

confidence: 90%

“…This shows that intergranular fracture had occurred between the Cu6Sn5 and Cu3Sn grains in the IMC region and cleavage fracture has happened within the Cu6Sn5 grains. Figure 10a,b) upon aging also degrades the fracture toughness of the IMC layer [39]. Clearly most of the locations in the fractured IMC region displayed a broken grain with a brittle cleavage plane.…”

Section: Effect Of Zro2 Nanoparticle Size On the Shear Strength And Fmentioning

confidence: 91%

“…Thicker Cu-Sn IMC after 256 h aging shares a weaker interface with the solder. Additionally, formation of Kirkendall voids (circled in Figure 10a and b) upon aging also degrades the fracture toughness of the IMC layer [39]. Clearly most of the locations in the fractured IMC region displayed a broken grain with a brittle cleavage plane.…”

Section: Effect Of Zro2 Nanoparticle Size On the Shear Strength And Fmentioning

confidence: 99%

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Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Rajendran

Hwang

Jung

2020

Metals

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This study investigates the shear strength and aging characteristics of Sn-3.0Ag-0.5Cu (SAC 305)/Cu joints by the addition of ZrO2 nanoparticles (NPs) having two different particle size: 5–15 nm (ZrO2A) and 70–90 nm (ZrO2B). Nanocomposite pastes were fabricated by mechanically mixing ZrO2 NPs and the solder paste. ZrO2 NPs decreased the β-Sn grain size and Ag3Sn intermetallic compound (IMC) in the matrix and reduced the Cu6Sn5 IMC thickness at the interface of lap shear SAC 305/Cu joints. The effect is pronounced for ZrO2A NPs added solder joint. The solder joints were isothermally aged at 175 °C for 24, 48, 144 and 256 h. NPs decreased the diffusion coefficient from 1.74 × 10–16 m/s to 3.83 × 10–17 m/s and 4.99 × 10–17 m/s for ZrO2A and ZrO2B NPs added SAC 305/Cu joints respectively. The shear strength of the solder joints decreased with the aging time due to an increase in the thickness of interfacial IMC and coarsening of Ag3Sn in the solder. However, higher shear strength exhibited by SAC 305-ZrO2A/Cu joints was attributed to the fine Ag3Sn IMC’s dispersed in the solder matrix. Fracture analysis of SAC 305-ZrO2A/Cu joints displayed mixed solder/IMC mode upon 256 h of aging.

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Section: Effect Of Zro2 Nanoparticle Size On the Shear Strength And Fsupporting

confidence: 90%

Section: Effect Of Zro2 Nanoparticle Size On the Shear Strength And Fmentioning

confidence: 91%

Section: Effect Of Zro2 Nanoparticle Size On the Shear Strength And Fmentioning

confidence: 99%

See 1 more Smart Citation

Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Rajendran

Hwang

Jung

2020

Metals

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“…When an interface is heavily voided, voids appear to act as a localised diffusion barrier. This behaviour has also been identified by previous studies into the effects of voiding on the diffusion process [2,9]. Voids located at the interface of Cu and Cu 3 Sn appear to affect the growth rates of the IMCs .…”

Section: Resultssupporting

confidence: 77%

Void formation in Cu-Sn SLID bonding for MEMS

Ross

Xü

Vuorinen

et al. 2014

Proceedings of the 5th Electronics System-Integration Technology Conference (ESTC)

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The hermetic sealing of a Micro Electronic Mechanical (MEMS) system is a critical requirement to the functional operation of MEMS devices. Cu-Sn SolidLiquid Inter-diffusion (SLID) bonding is one such encapsulation method of achieving hermetic sealing of MEMS devices. Recently, studies have identified a cause for concern relating to the reliability of SLID bonding. These studies have shown that electroplated (EP) copper is a source of higher voiding propensity. Labelled Kirkendall Voids (KV), which are micro voids that form at the interface of intermetallic compounds (IMC), due to the imbalance of Cu-Sn atom fluxes. KV have been shown to be a serious reliability issue which many studies have shown to seriously degrade the mechanical stability of interfaces. This paper will examine previous studies undertaken into the causes of KV, test whether KV are reproducible while varying EP parameters, and address the question, whether these are really KV? IntroductionMuch research has been conducted into the effects of voiding on the mechanical and electrical properties of not only SLID bonding but solder joints and interconnects. The research has concluded that an interface which displays high levels of voiding has severely reduced electrical and mechanical properties. Such negative effects included reduced mechanical properties, and to a more extreme extent, degradation of electrical properties [1,2].Previous studies have shown that the density of voiding in a solder joint is a function of the deposited Cu in a CuSn solder pair. High quality (Pure OFHC) Cu and Electrolyte was used to produce a Cu-Sn interface which was then subsequently thermally aged. Results from this showed that the High quality Cu was void free, and in contrast, the EP deposited Cu exhibited high levels of voiding [3,4].Although detailed studies have drawn attention to the reliability issues caused by voiding, the root-cause of voiding has not been extensively studied. One investigated cause of voiding is the incorporation of residual impurities into the EP copper layer which resulted in being a catalyst for void nucleation and growth. Organic impurities have been detected, from additives used in commercial plating solutions for controlling the EP deposition. Identified additives include, SPS (bis-sodium sulfopropyldisulfide), Cl-ions and PEG (polyethylene glycol) were acknowledged as sources of the deposited organic impurities [3,5,6].

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“…In an electromigration test, the Kirkendall voids in Figure 4 (b) may evoke current crowding, thus accelerating void propagation during current stressing [ 92 ]. Consequently, the presence of voids enclosed in the IMCs will seriously affect the reliability of the microbumps [ 93,94 ].…”

Section: Reliability Issues Concerning Imcsmentioning

confidence: 99%

Intermetallic compounds in 3D integrated circuits technology: a brief review

Annuar

Mahmoodian

Hamdi

et al. 2017

Science and Technology of Advanced Materials

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The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.

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Effect of Cu–Sn intermetallic compound reactions on the Kirkendall void growth characteristics in Cu/Sn/Cu microbumps

Cited by 44 publications

References 23 publications

Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Void formation in Cu-Sn SLID bonding for MEMS

Intermetallic compounds in 3D integrated circuits technology: a brief review

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