Intermetallic compounds in 3D integrated circuits technology: a brief review

Annuar, Syahira; Mahmoodian, Reza; Hamdi, M.; Tu, King‐Ning

doi:10.1080/14686996.2017.1364975

Cited by 69 publications

(18 citation statements)

References 102 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…[4][5][6] When the size of Cu pillar bumps reduces to several microns, the physical characteristics of the solder joint will change signi cantly, which raises new potential threats. [7,8] During the re ow and solid-state aging process, the excessive growth of intermetallic compound (IMC) would deplete the Sn solder [9]. Subsequently, abundant porous Cu 3 Sn is produced in the interface of Cu/Sn, [10,11,6] which decreases the mechanical strength of the solder joint.…”

Section: Introductionmentioning

confidence: 99%

Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps

Liu

Yang

Ling

et al. 2021

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

With the shrinkage of size, porous Cu 3 Sn have become a new potential threat of the reliability in micron Cu pillar bump. The formation of porous Cu 3 Sn is contributed the decomposition of Cu 6 Sn 5 , which is caused by the overgrowth of intermetallic compounds (IMC) and the stress introduced by the phase transition of Cu 6 Sn 5 . In this paper, uniform Ф10 µm Cu/Sn and Cu/Ni (~0.6 μm)/Sn microbumps have been fabricated by multilayer electrodeposition and the effect of the Ni layer on the growth behavior of porous Cu 3 Sn was investigated by comparing the evolution of IMC in Cu/Sn and Cu/Ni/Sn bumps aged at 170 ℃ and 200 ℃. The ~0.6 μm Ni layer can effectively retard the Cu atoms diffusion, which can hinder IMC from overgrowth. Moreover, with the help of X-ray diffraction (XRD), the ability of the Ni layer in stabilizing Cu 6 Sn 5 phase is strengthened, which weakens the tendency of the porous Cu 3 Sn formation.Under the conjoint action of retarding the growth of IMC and stabilizing Cu 6 Sn 5 phase, the Ni layer can inhibit the formation of porous Cu 3 Sn e caciously.

show abstract

Section: Introductionmentioning

confidence: 99%

Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps

Liu

Yang

Ling

et al. 2021

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

show abstract

“…However, due to the large difference in mechanical properties between the hard, but brittle, IMCs and the soft Cu-substrate and Sn-Cu solder, regions vulnerable to crack formation are created [3] when the IMC layers grow in thickness. Therefore, controlling the growth of the IMCs is key to improving the reliability of the solder joints, however, is till today not achieved, despite huge experimental efforts [4,5,6,7]. Due to the large number of influencing factors, there is often a large discrepancy between experimental findings from different studies.…”

Section: Introductionmentioning

confidence: 99%

Phase-field study of IMC growth in Sn–Cu/Cu solder joints including elastoplastic effects

2020

View full text Add to dashboard Cite

In this article, we aim to study the problem of the growth of intermetallic phases in solder joints undergoing mechanical deformation, using a phase-field model for multi-phase systems that can treat diffusion, elastic and plastic deformation. A suitable model is formulated and applied to Sn-Cu/Cu lead-free solder joints. The growth of the intermetallic layers during solid-state annealing is simulated for different strain states. We assess the values of stiffness tensors available in literature and perform ab initio calculations to support the selection of reasonable values from literature. We also perform a parametric study with different eigenstrain values and applied strains. We find that there is a significant effect of the considered eigenstrains and applied strains on the growth kinetics of the system and parabolic growth kinetics is followed in cases where the intermetallic layers grow. We thereby establish the importance of strain in the growth of intermetallic layers and the need for more targeted experiments on the role of strain in the reliability of the solder joint.

show abstract

“…However, solder joints in 3D structure would also work under stress perpendicular to the reaction interface which is introduced by extreme temperature gradient [5]. Furthermore, with the miniaturization of electronic devices, the volume ratio of intermetallic compound (IMC) to each solder joints rises quickly [6]. IMC would play a more prominent role in the reliability of microelectronics.…”

Section: Introductionmentioning

confidence: 99%

Influence of External Interface Normal Stress on the Growth of Cu–Sn IMC During Aging

Wang

Chen

Liu

2020

Acta Metall. Sin. (Engl. Lett.)

View full text Add to dashboard Cite

A U-shape clamp was designed to apply stress perpendicular to the interface of Cu/Sn/Cu solder joints, and its influence on the growth behavior of Cu-Sn intermetallic compound (IMC) during thermal aging at 150 °C was investigated. The results show that compared with the sample at general stress-free state, the growth rate of IMC under compression is faster, while that under tension is slower. Moreover, the interface between IMC and Sn is smoother under compressive stress, and the corresponding IMC grains are smaller and more uniform than that under tensile stress. According to the growth kinetic analysis, the growth of IMC under general, compressive and tensile states is all controlled by the combination of grain boundary diffusion and volume diffusion with a similar growth exponent (n ≈ 0.4). However, external stress can affect the Ostwald ripening process of grain growth, causing a change of grain size and grain boundary density in the IMC layer. As a result, the IMC growth behavior at the interface of the solder joint will be affected by the applied external normal stress.

show abstract

Intermetallic compounds in 3D integrated circuits technology: a brief review

Cited by 69 publications

References 102 publications

Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps

Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps

Phase-field study of IMC growth in Sn–Cu/Cu solder joints including elastoplastic effects

Influence of External Interface Normal Stress on the Growth of Cu–Sn IMC During Aging

Contact Info

Product

Resources

About