Effect of Cu Preferential Orientation on the Microstructure and Properties of Anodized Cu<i><sub>x</sub></i>O Films

Gao, Zhaoqing; Cao, Jinwei; Wang, Chen; Chen, Yinbo; Hussain, Muhammad Muzammal; Wang, Weiqiang; Sun, Hao; Ma, Haitao; Wang, Yunpeng

doi:10.1002/ejic.201901084

Cited by 10 publications

(6 citation statements)

References 45 publications

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“…Strain accumulation (figure 23 d ) has been observed around the oxide particles formed on (110) surface of Cu. Observation of oxides mostly on the (110) Cu plane is in contrast with the literature [39], which shows preferable growth of Cu 2 O on the (111) Cu plane. As the (110) planes have higher numbers of broken bonds and surface energy [39,40] compared to other low indices planes, (110) planes should be the prefer site for oxidation, but growth of oxides to the highest thickness has been noted on the (111) plane [41].…”

Section: Resultscontrasting

confidence: 87%

“…Observation of oxides mostly on the (110) Cu plane is in contrast with the literature [39], which shows preferable growth of Cu 2 O on the (111) Cu plane. As the (110) planes have higher numbers of broken bonds and surface energy [39,40] compared to other low indices planes, (110) planes should be the prefer site for oxidation, but growth of oxides to the highest thickness has been noted on the (111) plane [41]. This is probably due to the fact that because of high surface energy nucleation of oxides initiate throughout the (110) plane.…”

Section: (B) In Situ Heatingcontrasting

confidence: 99%

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Study of diffusionless and diffusional transformations usingin situcooling and heating techniques in a scanning electron microscope

Kumar

Sarkar

Singh

et al. 2020

Phil. Trans. R. Soc. A.

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In situ electron microscopy can be an effective tool to investigate the underlying science of many transformation mechanisms in materials science. Useful utilization of these experimentations will provide greater insight into many of the existing theories, as microstructural changes can be visualized in real time under some applied constraints. In this study, we have investigated two basic phase transformation phenomena: diffusionless and diffusional mechanisms with the help of in situ cooling and heating techniques in scanning electron microscope (SEM). In situ cooling experiments have been carried out on secondary hardening ultra-high-strength steels to understand the diffusionless transformation of austenite to martensite. Nucleation and growth of the martensites have been observed with cooling in different steps to −194°C. Details of the formation of different variants of martensites in steel were studied with the help of orientation imaging microscopy. Diffusional transformations were studied in terms of oxidation of pure copper in SEM using in situ heating technique. Different heating cycles were adopted for different samples by in situ heating to a maximum temperature of 950°C for the oxidation study. Nucleation of copper oxides and subsequent growth of the copper oxides at different temperatures were studied systematically. Raman spectroscopy and orientation imaging were done to confirm the formation of oxides and their orientations. The thermal cycling phenomenon was replicated inside SEM with heating and cooling and it has been demonstrated how the nature of copper and its oxides changes with the thermal cycle. This article is part of a discussion meeting issue ‘Dynamic in situ microscopy relating structure and function’.

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Section: Resultscontrasting

confidence: 87%

Section: (B) In Situ Heatingcontrasting

confidence: 99%

Study of diffusionless and diffusional transformations usingin situcooling and heating techniques in a scanning electron microscope

Kumar

Sarkar

Singh

et al. 2020

Phil. Trans. R. Soc. A.

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“…Moreover, Kirkendall voids, which was caused by the unequal diffusion of Sn and Cu atoms, was observed between Cu 3 Sn and Cu when the cycles of thermal cycling test exceeded 400. (2). Two different failure stages of the Sn-Bi-Ag solder joints was found after 3000 thermal cycles.…”

Section: Discussionmentioning

confidence: 97%

“…Traditional eutectic Sn42-Bi58 solder alloy has a melting point of 138 °C, and has been widely used in consumer electronic products compared with SAC305 solder due to its lower cost [1][2][3][4]. The wetting angle of Sn-Bi solder on Cu substrate is larger than that of Sn63-Pb37 alloy, indicating that Sn-Bi eutectic solder has a good wettability during reflow [5].…”

Section: Introductionmentioning

confidence: 99%

Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling

Chen

Wang

Gao

et al. 2021

J Mater Sci: Mater Electron

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Although many studies have reported the behaviors of thermal cycling of Snbased solder joints, the corresponding mechanism is difficult to describe universally due to the complexity of different cases. In the present study, microstructural evolution and failure of Sn-Bi57-Ag0.7 solder joints caused by thermal cycling between -40 and 85 °C from 0 to 1000 cycles were systematically investigated. The results indicated that the Sn-Bi-Ag solder joint was composed of Sn-rich phase, Bi-rich phase, large numbers of Bi dispersed-particles, and Ag 3 Sn precipitate. With the extension of time during thermal cycling, the microstructure of Sn-Bi-Ag solder joint gradually coarsened and the IMC layer became thicker (from 0.82 to 2.38 lm). However, Sn-Bi-Ag solder joints failed after 3000 thermal cycles. Two different stages of failure were found and the mechanism, related to the increment of thermal mismatch stress, was illuminated. Furthermore, Electron Backscattered Diffraction was used to detailedly elucidate the grain characteristics of the failed Sn-Bi-Ag solder joints, and the effect of thermal stress on orientations of Sn and Bi grains was also revealed. Being different from the orientation change observed in traditional Sn-Bi eutectic solder joints in previous studies, the present results demonstrated that both Sn and Bi grains did not present any preferred orientations after thermal cycling. And the reason of this phenomenon might be attributed to the Ag 3 Sn, which could be regarded as second-phase particles. Our present work would provide theoretical guidance for the development of new Sn-Bi-X solders with high reliabilities.

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“…The average thickness in the anodized samples is between 4.33 and 5.41 µm. The thickness of the aluminum oxide layer of coating greatly depends on the current density, the bath, and the time of anodization [41].…”

Section: Sem Microstructural Analysismentioning

confidence: 99%

Corrosion Behavior of AA2055 Aluminum-Lithium Alloys Anodized in the Presence of Sulfuric Acid Solution

et al. 2021

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The aim of this work was to evaluate the corrosion behavior of the AA2055 Aluminum-lithium alloy anodized in a sulfuric acid (H2SO4) bath, varying the current density of 0.19 and 1 A·cm−2 and why the sealing solution was water (H2O) and sodium dichromate (Na2Cr2O7). Anodized samples were exposed to a 10 vol.% H2SO4 solution and the electrochemical technique used was electrochemical impedance spectroscopy. Scanning electron microscopy and X-ray photoelectron spectroscopy were employed to characterization of the anodizing layer, determinate morphology and thickness of coatings. The Na2Cr2O7 sealing solution tends to increase the charge transfer resistance and produces a more homogeneous and compact passive oxide layer, and imparts a corrosion inhibition protection to the AA2055. SEM observations indicated that the morphology and thickness of the anodic films formed on AA2055 aluminum-lithium alloy anodized have the best results for both current densities.

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Effect of Cu Preferential Orientation on the Microstructure and Properties of Anodized Cu_xO Films

Cited by 10 publications

References 45 publications

Study of diffusionless and diffusional transformations usingin situcooling and heating techniques in a scanning electron microscope

Study of diffusionless and diffusional transformations usingin situcooling and heating techniques in a scanning electron microscope

Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling

Corrosion Behavior of AA2055 Aluminum-Lithium Alloys Anodized in the Presence of Sulfuric Acid Solution

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Effect of Cu Preferential Orientation on the Microstructure and Properties of Anodized CuxO Films

Cited by 10 publications

References 45 publications

Study of diffusionless and diffusional transformations usingin situcooling and heating techniques in a scanning electron microscope

Study of diffusionless and diffusional transformations usingin situcooling and heating techniques in a scanning electron microscope

Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling

Corrosion Behavior of AA2055 Aluminum-Lithium Alloys Anodized in the Presence of Sulfuric Acid Solution

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Effect of Cu Preferential Orientation on the Microstructure and Properties of Anodized Cu_xO Films