2004
DOI: 10.1063/1.1794370
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Effect of chemical functionalization on thermal transport of carbon nanotube composites

Abstract: We use molecular dynamics simulations to analyze the role of chemical bonding between the matrix and the fiber on thermal transport in carbon nanotube organic matrix composites. We find that chemical bonding significantly reduces tube-matrix thermal boundary resistance, but at the same time decreases intrinsic tube conductivity. Estimates based on the effective medium theory predict increase, by about a factor of two, of the composite conductivity due to functionalization of single-walled nanotubes with aspect… Show more

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Cited by 267 publications
(177 citation statements)
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“…Atomistic structures with variations in CNT functionalization are first prepared using standard molecular dynamics (MD) techniques. A methodology [4][5][6] is applied to calculate the interfacial thermal resistance, R K , in these structures. These R K values are then used with analytical modeling in order to consider the effect of chemical functionalization of SWCNTs on the thermal properties of the resulting nanocomposite.…”
Section: Methodsmentioning
confidence: 99%
See 3 more Smart Citations
“…Atomistic structures with variations in CNT functionalization are first prepared using standard molecular dynamics (MD) techniques. A methodology [4][5][6] is applied to calculate the interfacial thermal resistance, R K , in these structures. These R K values are then used with analytical modeling in order to consider the effect of chemical functionalization of SWCNTs on the thermal properties of the resulting nanocomposite.…”
Section: Methodsmentioning
confidence: 99%
“…2-5, a value of 0.2 W/mK is used for K m . Two values are used for K c : 6000 W/mK and 3000 W/mK [2,5].…”
Section: Analytical Modeling Of the Thermal Conductivitymentioning
confidence: 99%
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“…This phenomenon was explained by increasing the transmission coefficient of the phonons [263,278]. Modification of the end groups of the polymer chains [261] and surface modification of the fillers (either with [237,[280][281][282][283][284] or applying specific coatings [285][286][287]) are common methods for improving the adhesion at the interfaces with subsequent thermal conductivity enhancement. However, it should be considered that the functionalization of the filler may create defects and decrease the intrinsic thermal conductivity of them [288].…”
Section: Thermal Conductivitymentioning
confidence: 99%