Effect of backbone moiety in diglycidylether-terminated liquid crystalline epoxy on thermal conductivity of epoxy/alumina composite

Giang, Thanhkieu; Kim, Jinhwan

doi:10.1016/j.jiec.2015.05.004

Cited by 29 publications

(9 citation statements)

References 47 publications

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“…A recent study has experimentally demonstrated that inclusion of silane compatibilizer significantly enhanced effective thermal conductivity at high concentration of a-alumina nanoparticles (Giang and Kim 2015). Thus, a nanocomposite composed of a-alumina nanofillers applied as thermally conductive material has exhibited agglomeration when sandwiched between nanometer-depth-polymers (Tanaka et al 2015).…”

Section: Thermal Conductivity Of Inorganicnanoparticle-based Pncsmentioning

confidence: 99%

“…Thus, a nanocomposite composed of a-alumina nanofillers applied as thermally conductive material has exhibited agglomeration when sandwiched between nanometer-depth-polymers (Tanaka et al 2015). Hence, a recent study theoretically addressed effective heat conductivity of such a filler-polymer-filler-system (Giang and Kim 2015).…”

Section: Thermal Conductivity Of Inorganicnanoparticle-based Pncsmentioning

confidence: 99%

“…Presently, TIMs are mainly based on polymers and greases/adhesives reinforced with thermally conductive nanoparticles including silica, silver or alumina, silica, and so on , Giang and Kim 2015, Kamseu et al 2015, Sato et al 2015. However, these nanoparticles require inclusion of about 50-70 vol.% filler to attain thermal conductivity values ranging from 1 to 5 W/m K (Hou et al 2015).…”

Section: Introductionmentioning

confidence: 99%

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Recently emerging trends in thermal conductivity of polymer nanocomposites

Idumah

Hassan²

2016

Reviews in Chemical Engineering

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Due to escalating power densities in electronics, information, communication, energy storage, aerospace, and automobile technologies, heat dissipation has become immensely essential for the efficient performance and reliability of photonic, electronics, optoelectronics, and other devices in order to proactively prevent premature failure due to overheating. The functionalization and synergistic inclusion of thermally conducting nanoparticles such as carbon derivatives and metallic and ceramic fillers into polymer matrices have resulted in development of thermally conducting polymer nanocomposites. This has enlarged the scope of application of these materials in areas hitherto restricted due to poor thermal conductivity and, therefore, opened broad windows of opportunities for polymer nanocomposites as emerging alternative replacements for metal components in various applications where effective heat dissipation is compulsory for device performance. Thus, this paper critically discusses globally emerging technologies applied in the development of thermally conductive polymer nanocomposites for various industrial applications.

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Section: Thermal Conductivity Of Inorganicnanoparticle-based Pncsmentioning

confidence: 99%

Section: Thermal Conductivity Of Inorganicnanoparticle-based Pncsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Recently emerging trends in thermal conductivity of polymer nanocomposites

Idumah

Hassan²

2016

Reviews in Chemical Engineering

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“…One can see according to (1) that at a fixed filler loading, a resin matrix with higher thermal conductivity can more effectively increase the thermal conductivity of the composites. Recent research by Giang and Kim [14] on the epoxy/alumina composites documented that the influence of thermal conductivity of epoxy thermosets on the thermal conductivity of composites. As shown in Fig.…”

Section: Importance Of High Pristine Thermal Conductivity Of Epoxy Thmentioning

confidence: 99%

“…(b) Here three diglycidylether‐terminated LCE structures based on azomethine mesogen, 4040‐bis(4‐hydroxybenzylidene)‐diaminodiphenylether diglycidylether (DPE), 4040‐bis(4‐hydroxybenzylidene)‐diaminophenylene diglycidylether (DP) and terephthalylidene‐bis‐(4‐aminophenol) diglycidylether (TA) were used as matrices. Reproduced with permission from [14]…”

Section: Importance Of High Pristine Thermal Conductivity Of Epoxy mentioning

confidence: 99%

Epoxy thermoset resins with high pristine thermal conductivity

et al. 2017

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Heat dissipation becomes a critical problem because of the miniaturisation and the increase of power density in electronic devices and electric equipment, which calls for electrical insulating materials with high thermal management capability. Epoxy thermosets have been widely used as electrical insulating materials, but suffer from their low thermal conductivity. This study reviewed the research progress on the development of epoxy thermosets with high pristine thermal conductivity. First, the thermal conduction mechanism of polymers was briefly introduced. Second, the approaches used to enhance the thermal conductivity of epoxy thermosets were summarised, which mainly dealt with the formation of microscopically anisotropic but macroscopically isotropic structure in the epoxy thermosets. Third, the applications of high thermal conductivity epoxy thermoset resins were reviewed. Finally, the review provided the existing challenges and the future directions for the development of epoxy thermosets with high pristine thermal conductivity.

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Biphenyl liquid crystal epoxy containing flexible chain: Synthesis and thermal properties

Zhang

Chen

et al. 2020

J of Applied Polymer Sci

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A biphenyl type liquid crystal epoxy (LCE) monomer 4,4′‐di(2,3‐epoxyhexyloxy)biphenyl (LCBP4) containing flexible chain was synthesized and the curing behavior was investigated using 4,4′‐diaminodiphenylmethane (DDM) as the curing agent. The effect of curing condition on the formation of the liquid crystalline phase was examined. The cured samples show good mechanical properties and thermal stabilities. Moreover, the relationship between thermal conductivity and structure of liquid crystalline domain was also discussed. The samples show high thermal conductivity up to 0.28–0.31 W/(m*K), which is 1.5 times as high as that of conventional epoxy systems. In addition, thermal conductive filler, Al2O3, was introduced into LCBP4/DDM to obtain higher thermal conductive composites. When the content of Al2O3 was 80 wt%, the thermal conductivity of the composite reached to 1.86 W/(m*K), while that of diglycidyl ether of bisphenol A (Bis‐A) epoxy resin/DDM/Al2O3 was 1.15 W/(m*K). Compared with Bis‐A epoxy resin, the formation of liquid crystal domains in the cured LCE resin enhanced the thermal conductivity synergistically with the presence of Al2O3. Furthermore, the introduction of Al2O3 also slightly increased the thermal stabilities of the cured LCE.

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Effect of backbone moiety in diglycidylether-terminated liquid crystalline epoxy on thermal conductivity of epoxy/alumina composite

Cited by 29 publications

References 47 publications

Recently emerging trends in thermal conductivity of polymer nanocomposites

Recently emerging trends in thermal conductivity of polymer nanocomposites

Epoxy thermoset resins with high pristine thermal conductivity

Biphenyl liquid crystal epoxy containing flexible chain: Synthesis and thermal properties

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