We chose two commercial epoxies, bisphenol A diglycidyl ether (DGEBA) and 3,3 0 ,5,5 0 -tetramethyl-4,4 0 -biphenol diglycidyl ether (TMBP), and synthesized one liquid crystalline epoxy (LCE), 4 0 4 0 -bis(4-hydroxybenzylidene)-diaminophenylene diglycidyl ether (LCE-DP) to investigate the effect of backbone moiety in epoxies on the thermal conductivity of epoxy/alumina composite. The DGEBA structure shows an amorphous state and the TMBP structure displays a crystal phase, whereas the LCE-DP structure exhibits a liquid crystalline phase. The curing behaviors of them were examined employing 4,4 0 -diaminodiphenylsulfone (DDS) as a curing agent. The heat of curing of epoxy resin was measured with dynamic differential scanning calorimetry (DSC). Alumina (Al 2 O 3 ) of commercial source was applied as an inorganic filler. Thermal conductivity was measured by laser flash method and compared with value predicted by two theoretical models, Lewis-Nielsen and Agari-Uno. The results indicated that the thermal conductivity of the LCE-DP structure was larger than that of the commercial epoxy resins such as TMBP and DGEBA and the experimental data fitted quite well in the values estimated by Agari-Uno model.

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