Effect of Aging Precipitation on Properties of Cu-Ni-Si-Mg Alloy

Abstract

The Cu-Ni-Si-Mg alloy was treated by aging after varying cold deformation. The effect of cold deformation, aging temperature and aging time on the microstructure and properties of the alloy were investigated. The results indicate that the alloy produce a larger number of slip bands and dislocations after cold deformation, it can accelerate the precipitation of phase during aging, improve the microhardness and electrical conductivity. The microhardness and electrical conductivity of the alloy with 80% deformation aging at 723 K for 1h are 242HV and 35.53%IACS, respectively. The volume fraction of the precipitated phase was calculated by measuring the electrical conductivity of the alloy with 80% deformation aging at 773 K, then both the equations of phase transformation and the electrical conductivity equation were obtained.

Effects of shot peening on the fatigue performance of ultrafine-grained CuNi3Si1Mg

“…During aging of a supersaturated solid solution, the Cu-matrix remains relatively pure with only a few interstitial or substitutional atoms left in the matrix due to the accumulation of alloying elements as fine precipitates. Furthermore, finely dispersed precipitates that act as dislocation obstacles maintain high yield strength [1,[3][4].…”

Effect of Deep Cryogenic Treatment on Electrical Conductivity of Cu-Base Multicomponent Alloy

“…Due to excellent properties in strength, thermal conductivity and electrical conductivity, Cu alloy is widely applied in various fields such as integrated circuit frame, Welding electrodes, and switch contacts of Electrical engineering [1][2][3][4]. With the rapid development of technology and modern industry, Cu alloy with higher properties are required.…”