Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects

Lu, Henry Y.; Balkan, H.; Ng, Koon‐Kwan

doi:10.1007/s10854-006-6758-y

Cited by 39 publications

(14 citation statements)

References 33 publications

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“…Therefore, it seems that the formation of the plate-like compounds is caused by the presence of the Cu 6 Sn 5 interfacial layer, which prompts a depletion of the Sn content in the local region of the solder microstructure and leads to a corresponding enrichment in the local Ag content as a result. As reported in [10,20,8], the presence of a high Ag content has a clear effect on promoting the nucleation and formation of large plate-like Ag 3 Sn IMCs. Therefore, primary Ag 3 Sn crystals form near the Cu 6 Sn 5 interfacial layer during the initial stages of the solidification process.…”

Section: Evolution Of Ag 3 Sn Intermetallic Compounds Formed During Wsupporting

confidence: 56%

Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder

Lee

Chen

2011

Journal of Alloys and Compounds

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Section: Evolution Of Ag 3 Sn Intermetallic Compounds Formed During Wsupporting

confidence: 56%

Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder

Lee

Chen

2011

Journal of Alloys and Compounds

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“…[19][20][21][22][23] Many studies examine the reliability of solder joints arising from evolution of intermetallic morphology in the interface. [24][25][26][27][28][29] In contrast to lead-tin-based solders, for which the probability of fracture is directly related to the strain amplitude, crystal orientations in initial tin-phase microstructure have a large impact on reliability of lead-free solders, [30][31][32][33][34][35][36][37][38][39][40][41][42][43][44][45][46][47][48][49] so damage can develop in any region of a package. To predict deformation during the TMF cycling of a solder joint, a deep knowledge of deformation mechanisms in Sn is required.…”

Section: Introductionmentioning

confidence: 99%

Anisotropic Crystal Plasticity Finite Element Modeling of the Effect of Crystal Orientation and Solder Joint Geometry on Deformation after Temperature Change

Zamiri

Bieler

Pourboghrat

2008

Journal of Elec Materi

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The crystal orientation of the tin phase in a Pb-free Sn solder joint has a significant effect on the stress state, and hence on the reliability of the solder joint. A set of crystal plasticity analyses was used to evaluate stress and strain resulting from a 165°C temperature change in a single-crystal joint using two simplified geometries used in practical solder joints. Phenomenological flow models for ten slip systems were estimated based upon semiquantitative information available in the literature, along with known anisotropic elastic property information. The results show that the internal energy of the system is a strong function of the tin crystal orientation and geometry of the solder joint. The internal energy (and presumably the likelihood of damage) is highest when the crystal c-axis lies in the plane of the substrate, leading to significant plastic deformation. When the a-axis is in the plane of the interface, deformation due to a 165°C temperature change is predominantly elastic. The texture of the copper substrate using isotropic Cu elastic properties, or anisotropic elastic properties with [001] k substrate normal direction, does not have a significant effect on the stress or strain in the Sn phase of the joint.

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“…The formation of Ag 3 Sn plates is related to increases in Ag content and undercooling of the solder alloy. 16 Figure 5a and b presents SEM images of the Ag 3 Sn compounds formed in the as-cast Sn-3.5Ag solder and the Sn-3.5Ag-1.0La solder, respectively. The SEM micrograph (30009) in Fig.…”

Section: Resultsmentioning

confidence: 99%

Influence of Lanthanum Additions on the Microstructure and Microhardness of Sn-3.5Ag Solder

Lee

Chen

2009

Journal of Elec Materi

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This study evaluates the effects of different amounts of lanthanum (La) additions on the microstructure and microhardness of Sn-3.5Ag solders. Sn-3.5Ag-xLa ternary solders were prepared by adding 0 wt.% to 1.0 wt.% La to Sn-3.5Ag alloy. Copper substrates were then dipped in the molten solders and these samples aged at 150°C for up to 625 h. The microstructure and microhardness of the as-solidified solder and the aged solder/copper samples were investigated. The Sn-3.5Ag-xLa solders comprised b-Sn, Ag 3 Sn, and LaSn 3 phases, and their microstructure was refined by La additions. As-cast, the addition of La increased the microhardness of the Sn-Ag solder due to the refining effect of Ag 3 Sn particles and increased formation of LaSn 3 compounds. As the aging time was increased, the microhardness of the solders decreased and the Ag 3 Sn compounds coarsened. However, the coarsening of Ag 3 Sn compounds was retarded by La, and the size and amount of LaSn 3 compounds did not change perceptibly with aging time. Therefore, La additions can improve the microhardness and thermal resistance of solder joints.

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Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects

Cited by 39 publications

References 33 publications

Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder

Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder

Anisotropic Crystal Plasticity Finite Element Modeling of the Effect of Crystal Orientation and Solder Joint Geometry on Deformation after Temperature Change

Influence of Lanthanum Additions on the Microstructure and Microhardness of Sn-3.5Ag Solder

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