Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder

Lee, Hwa Teng; Chen, Yin Fa

doi:10.1016/j.jallcom.2010.11.068

Cited by 48 publications

(14 citation statements)

References 17 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In previous work, the growth of Ag 3 Sn is concluded according to the shape, size and distribution of Ag 3 Sn formed after soldering solidification [10][11][12]. Cooling rates are related to the sizes of Ag 3 Sn [13,14], which can explain the growth behaviors are greatly affected by the solidification process. As the solidification process is a ''black box'', all the experimental results are gained at the end of solidification, which may have big errors compared with practical one.…”

Section: Introductionmentioning

confidence: 99%

In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology

Huang

et al. 2012

Journal of Alloys and Compounds

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 99%

In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology

Huang

et al. 2012

Journal of Alloys and Compounds

View full text Add to dashboard Cite

“…Concerning the microstructure of SAC solder, it is a mixture of Sn and IMC, such as Ag 3 Sn and Cu 6 Sn 5 . The survey literature [5] showed that three types of Ag 3 Sn compounds during solidification at different cooling rates are found to be particle-like, needle-like and plate-like. The mechanical properties of solder will be anisotropic when the IMC dispersion in Sn matrix is inhomogeneous [3].…”

Section: Introductionmentioning

confidence: 99%

Evolution of Ag3Sn at Sn–3.0Ag–0.3Cu–0.05Cr/Cu joint interfaces during thermal aging

Lin

et al. 2011

Journal of Alloys and Compounds

View full text Add to dashboard Cite

“…Lewis et al [56] and Park et al [57] report that in eutectic Sn-Ag-Cu solder alloy, Cu6Sn5 intermetallic are the dominant intermetallic to form. Large plate-like primary Ag3Sn were able to be observed on a high silver content solder alloy [58,59]. In addition, several studies indicate that in Sn-Cu and Sn-Ag-Cu solder alloys, the non-planar Cu6Sn5 primary intermetallic typically forms in branches where it is hypothesized that it grows from a central point before separating into distinct branches [60,61].…”

Section: Fabrication Methods Of Reinforced Soldersmentioning

confidence: 99%

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

Salleh¹,

Anuar²

View full text Add to dashboard Cite

Electronics manufacturers are pushing the limits in reducing the physical size of circuitry while simultaneously increasing the number of transistors to satisfy Moore's Law [1]. This includes investing in new materials, and configuring new ways to manufacture complex 3D (three dimensional) electronic packaging [1]. One key requirement of new materials and techniques is ensuring the high reliability of the resultant products in various challenging operating environments including thermal and mechanical extremes [2][3][4]. A viable method to enhance the properties and performance of a solder joint is by incorporation of reinforcement particles to the solder matrix, either by intrinsic or extrinsic methods. In this thesis a series of Sn-Cu Pb-free solder alloys with extrinsic or intrinsic phase reinforcement were manufactured and the microstructure and soldering behavior were investigated in detail.Additions of extrinsic reinforcement in the form of nano-sized ceramic material were made using a microwave sintering powder metallurgy (PM) method, which is a viable method to improve the mechanical and thermal properties of Pb-free solder materials. In addition, the advanced processing routes ensures a homogenous distributions of reinforcement particles is present. To investigate the performance of the reinforced bulk solders including thermal and mechanical properties and relate this to the microstructure, samples were investigated using techniques such as synchrotron micro-XRF, HRTEM, SEM, XPS, dilatometery, DSC and shear and microhardness testing. A hypothesis of how reinforcement improves solder properties is developed and discussed. Synchrotron X-ray radiography imaging (SXRI) was used to analyse the development of microstructure and the complex interactions occurring in the solders. Based on the properties of the fabricated solder, the microwave sintering PM route was discussed as a promising method for the reinforcement of Pb-free solders.The initial formation of interfacial IMC products was studied in Sn-Cu based solder alloys by in situ experiment techniques such as SXRI and UHV-TEM. The results provide direct experimental evidence of real-time initial Cu6Sn5 layer development during soldering and also the stress creation and release events that arise due to the polymorphic transformations of the Cu6Sn5 phase and the associated volumetric change.ii In addition, the nucleation and growth behavior of primary intermetallics which can be considered an intrinsic reinforcing material in solder joints was studied. Here, the nucleation and growth behavior of primary Cu6Sn5 and β-Sn crystals in some of the most commonly used solder alloys including Sn-0.7Cu and Sn-3.0Ag-0.5Cu is explained. This also includes the effects of Ni additions for refining primary Cu6Sn5 in Sn-Cu solder joints. Using SXRI, observations were made during solder joint solidification, which is difficult using conventional methods. The initial nucleation and solidification kinetics of primary Cu6Sn5 crystals were discussed.The growth of pri...

show abstract

Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder

Cited by 48 publications

References 17 publications

In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology

In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology

Evolution of Ag3Sn at Sn–3.0Ag–0.3Cu–0.05Cr/Cu joint interfaces during thermal aging

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

Contact Info

Product

Resources

About