In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology

In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn–Cu solder alloys

“…Figure 3 describes the morphologies of Cu 6 Sn 5 in the solder alloys, which are marked in ellipse (I-like shapes) and in circle (bird-like shapes). The morphologies of these Cu 6 Sn 5 IMCs are a little different from that observed in synchrotron microradiography experiment, which was also reported in previous study [5]. The reason is probably the different crystal structures.…”

“…In recent years, environmental concerns, legislation, and even customer preferences are propelling the microelectronics industry towards implementation of lead-free solder alloys [3,4]. Among all Pb-free solder alloys, the Sn-Cu solder system, which shows good mechanical properties (ductility, creep resistance and thermal resistance), electrical properties and low cost, is proven to be one of the most promising Pb-free candidates for electronic assembly, compared with other Sn-based solder systems [5][6][7]. During soldering process, the intermetallic compounds (IMCs) are generally formed at the Sn-Cu solder/Cu interface [8,9].…”

In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper

“…The ex situ investigation of intermetallic compound growth undergoing electromigration has been described in [3][4][5] whereas in situ study on this topic has been performed by Kim et al [6]. The Cu pillar samples prepared for in situ study of electromigration related phenomena in [6] were cut into half by polishing them.By using synchrotron radiation real-time imaging technology, the destruction and the deviation in experimental results owing to dimensional errors among different testing samples could be avoided effectively [7][8][9]. In this study, synchrotron radiation real-time imaging technology was utilized for conducting the in situ observation of the rate of change of Cu 6 Sn 5 IMC thickness at the anode side of a Cu/molten Sn/Cu solder joint undergoing electromigration.…”

Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography

“…However, the dynamic analysis of diffusion behavior is needed for more in depth study compared with the conventional static study. Much studies [19][20][21][22][23][24][25][26][27] have shown that in situ and real time observation of crystal growth can now be achieved by applying synchrotron X-ray radiography with satisfying spatial and temporal resolution. This imaging technique can also be applied to uncover the dynamic interface diffusion process of bimetals.…”