Dynamic modeling and measurement of personal computer motherboards

Reliability Analysis of Electronic Equipment Subjected to Shock and Vibration – A Review

“…This method does not directly give the local PCB response, and is only compatible with the deflection based failure criteria provided by Steinberg. The validity of the transmissibility assumption is questionable, as Pitarresi et al [53] measured critical damping of 2% for a computer motherboard, whilst using the given assumption would have given 3.5% (based on a natural frequency of 54 Hz), which would have lead to a large underestimate of the response.…”

“…Several authors demonstrate the use of detailed FE models to calculate the PCB vibration response [30,37,53,57,58] (Figs 1 to 3 show examples at increasing level of detail); however the use of these techniques would not be recommended for a commercial case (unless a precise prediction of the local response was absolutely vital), as the time required to build and solve such a model is excessive when simplified models produce data of appropriate accuracy much more quickly and with less effort. The time required to build and solve a detailed FE model can be reduced by using the JEDEC 4 lead spring constants published by [33][34][35], these spring constants can be used in place of a detailed FE model of each lead 5 .…”

“…Lau et al [36] looked at the reliability of PLCC, PQFP and QFP components to in-plane and out-of-plane shocks. Pitarresi et al [53,55] look at the failure of the failure of PC motherboards to shock loads and provides a good review of shock related literature of electronic equipment. Steinberg [62] provides a complete chapter on the design and analysis of electronic equipment subjected to shock, looking at both how to predict the shock environment and also providing some practical advice on how to avoid shock failure.…”

“…Pitarresi et al [53][54][55] use detailed FE model of PCB's to predict the response to shock and vibration, with components modelled as simple block 3D elements. These models used experimentally determined constant damping ratios to improve the prediction of response at resonance.…”

Package and board level reliability modeling of advanced CSP pakages for telecommunication applications

“…The mechanical shock and random vibration response of personal computer motherboards were measured and modeled by Pitarresi et al[116]. The effect of strain rate on solder joint failure under mechanical loading was reported by 2.9.…”