The Effect of Freestream Flow Velocities on the Flexible Printed Circuit Board with Different BGA Package Arrangements

Lim, Chong Hooi; Abdullah, M. Z.; Azid, Ishak Abdul; Khor, C. Y.

doi:10.1007/s13369-017-2491-5

Cited by 4 publications

(4 citation statements)

References 30 publications

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“…The numerical findings and experimental results were validated in good agreement (Lim et al, 2017b(Lim et al, , 2020. Similar simulation methods had been used in the FPCB's idle state study (Lim et al, 2017c;Leong et al, 2013b), biomedical engineering (Lopes et al, 2020) and microelectronics study (Abdul Aziz et al, 2015b. Hence, the current numerical method is reliable for the present analysis.…”

Section: Modelling Approachmentioning

confidence: 58%

“…Leong also indicated that for FPCB electronics, the vertical design was strongly recommended because it delivers the least amount of deflection and stress. According to the author's prior research (Lim et al, 2017a(Lim et al, , 2017c, the influence of Re is significant, with a maximum percentage change for d /L of around 450% and a maximum percentage change for the stress of about 300% from Re = 7,680 À 38,400. Furthermore, research has indicated that Re and the quantity of BGA packages have a greater impact on stress than d /L.…”

Section: Introductionmentioning

confidence: 99%

“…Furthermore, Re had a strong influence on the soldering connection and FPCB's deflection. the authors (Leong et al, 2013a, 2013b;Lim et al, 2017a;Lim et al, 2017c) performed research to better understand the mechanical performance of FPCB in different flow environments without considering the thermal aspect as shown in Table 1. Perspex blocks were used to mimic the electronic components in Leong's research whilst ball grid array (BGA) packages were used in the author's studies.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology

Lim

Abdullah

Aziz

et al. 2021

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Purpose This study aims to investigate the interaction of independent variables [Reynolds number (Re), thermal power and the number of ball grid array (BGA) packages] and the relation of the variables with the responses [Nusselt number ((Nu) ¯ ), deflection/FPCB’s length (d/L) and von Mises stress]. The airflow and thermal effects were considered for optimizing the Re of various numbers of BGA packages with thermal power attached on flexible printed circuit board (FPCB) for optimum cooling performance with least deflection and stress by using the response surface method (RSM). Design/methodology/approach Flow and thermal effects on FPCB with heat source generated in the BGA packages have been examined in the simulation. The interactive relationship between factors (i.e. Re, thermal power and number of BGA packages) and responses (i.e. deflection over FPCB length ratio, stress and average Nusselt number) were analysed using analysis of variance. RSM was used to optimize the Re for the different number of BGA packages attached to the FPCB. Findings It is important to understand the behaviour of FPCB when exposed to both flow and thermal effects simultaneously under the operating conditions. Maximum d/L and von Misses stress were significantly affected by all parametric factors whilst (Nu)¯ is significantly affected by Re and thermal power. Optimized Re for 1–3 BGA packages with maximum thermal power applied has been identified as 21,364, 23,858 and 29,367, respectively. Practical implications This analysis offers a better interpretation of the parameter control in FPCB with optimized Re for the use of force convection electronic cooling. Optimal Re could be used as a reference in the thermal management aspect in designing the BGA package. Originality/value This research presents the parameters’ effects on the reliability and heat transfer in FPCB design. It also presents a method to optimize Re for the different number of BGA packages attached to increase the reliability in FPCB’s design.

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Section: Modelling Approachmentioning

confidence: 58%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology

Lim

Abdullah

Aziz

et al. 2021

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“…The grid independency test has been presented by Lim et al (2017d) while the numerical results were validated in good agreement with the experimental findings (Lim et al, 2017b(Lim et al, , 2017d. Beside, similar simulation approaches had been used in the integrated circuit encapsulation investigation (Khor et al, 2012), FPCB's idle state study (Lim et al, 2017c) and wave soldering process analysis (Abdul Aziz et al, 2015). Therefore, the present numerical approach is reliable for the current study.…”

Section: Modelling Toolsmentioning

confidence: 74%

Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects

Lim

Abdullah

Azid

et al. 2020

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Purpose The purpose of this study is to investigate heat transfer and deformation of flexible printed circuit board (FPCB) under thermal and flow effects by using fluid structure interaction. This study simulate the electronic cooling process when electronic devices are generating heat during operation at FPCB under force convection. Design/methodology/approach The thermal and flow effects on FPCB with attached ball grid array (BGA) packages have been investigated in the simulation. Effects of Reynolds number (Re), number of BGA packages attached, power supplied to the BGA packages and size of FPCB were studied. The responses in the present study are the deflection/length of FPCB (δ/L) and Nusselt number (Nu). Findings It is important to consider both thermal and flow effects at the same time for understanding the characteristic of FPCB attached with BGA under operating condition. Empirical correlation equations of Re, Prandtl number (Pr), δ/L and Nu have been established, in which the highest effect is of Re, followed by Pr and δ/L. The δ/L and Nu¯ were found to be significantly affected by most of the parametric factors. Practical implications This study provides a better understanding of the process control in FPCB assembly. Originality/value This study provides fundamental guidelines and references for the thermal coupling modelling to address reliability issues in FPCB design. It also increases the understanding of FPCB and BGA joint issues to achieve high reliability in microelectronic design.

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A review on numerical approach of reflow soldering process for copper pillar technology

Lee

Aziz

Ishak

et al. 2022

Int J Adv Manuf Technol

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The Effect of Freestream Flow Velocities on the Flexible Printed Circuit Board with Different BGA Package Arrangements

Cited by 4 publications

References 30 publications

Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology

Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology

Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects

A review on numerical approach of reflow soldering process for copper pillar technology

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