2016
DOI: 10.1109/led.2016.2589967
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Double-Gate Modulated Corbino TFTs

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Cited by 4 publications
(3 citation statements)
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“…The exact t IGZO at which bulk accumulation (BA) in DG TFTs starts to occur is very difficult to establish as it is not only dependent on t IGZO , but also dependent on the quality of gate insulator/active layer interface, bulk traps, and bias condition. For the fabrication process herein, however, TCAD simulation of the electron concentration from the top and bottom surface of the a-IGZO channel indicated that t IGZO < 25 nm results in BA [14]. Therefore, small I D changes are observed for t IGZO > 20 nm.…”
Section: P-76 / M M Billahmentioning
confidence: 94%
“…The exact t IGZO at which bulk accumulation (BA) in DG TFTs starts to occur is very difficult to establish as it is not only dependent on t IGZO , but also dependent on the quality of gate insulator/active layer interface, bulk traps, and bias condition. For the fabrication process herein, however, TCAD simulation of the electron concentration from the top and bottom surface of the a-IGZO channel indicated that t IGZO < 25 nm results in BA [14]. Therefore, small I D changes are observed for t IGZO > 20 nm.…”
Section: P-76 / M M Billahmentioning
confidence: 94%
“…That's why we tried to increase the output resistance by using Corbino-TFT. [9]. We made the driving transistor and the load transistor the same condition so that the two transistors meet in the saturation region.…”
Section: Corbino-tftmentioning
confidence: 99%
“…Cross-sectional distributions of electron concentration showing evidence of volume accumulation, including the density of states parameters for the TCAD simulation, can be found in Ref. 43.…”
Section: Volume Accumulationmentioning
confidence: 99%